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Reliability of Microtechnology

Interconnects, Devices and Systems

Johan Liu, Olli Salmela, Jussi Sarkka, James E. Morris, Per-Erik Tegehall (Autoren)

Buch | Hardcover

204 Seiten

2011
Springer-Verlag New York Inc.
978-1-4419-5759-7 (ISBN)

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Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail.

The book also includes exercises and detailed solutions at the end of each chapter.

Introduction to Reliability and its Importance.- Reliability Metrology.- General Failure Mechanisms of Microsystems.- Solder and Conductive Adhesive Joint Reliability.- Accelerated Testing.- Reliability Design for Manufacturability.- Component Reliability.- System Level Reliability.- Reliability and Quality Management of Microsystem.- Experimental Tools for Reliability Analysis.

Erscheint lt. Verlag	14.2.2011
Zusatzinfo	XIII, 204 p.
Verlagsort	New York, NY
Sprache	englisch
Maße	155 x 235 mm
Themenwelt	Technik ► Bauwesen
	Technik ► Elektrotechnik / Energietechnik
	Technik ► Maschinenbau
ISBN-10	1-4419-5759-6 / 1441957596
ISBN-13	978-1-4419-5759-7 / 9781441957597
Zustand	Neuware