Reliability of Microtechnology
Interconnects, Devices and Systems
Seiten
2014
Springer-Verlag New York Inc.
978-1-4899-8211-7 (ISBN)
Springer-Verlag New York Inc.
978-1-4899-8211-7 (ISBN)
Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail.
The book also includes exercises and detailed solutions at the end of each chapter.
The book also includes exercises and detailed solutions at the end of each chapter.
Introduction to Reliability and its Importance.- Reliability Metrology.- General Failure Mechanisms of Microsystems.- Solder and Conductive Adhesive Joint Reliability.- Accelerated Testing.- Reliability Design for Manufacturability.- Component Reliability.- System Level Reliability.- Reliability and Quality Management of Microsystem.- Experimental Tools for Reliability Analysis.
Erscheint lt. Verlag | 11.10.2014 |
---|---|
Zusatzinfo | XIII, 204 p. |
Verlagsort | New York |
Sprache | englisch |
Maße | 155 x 235 mm |
Themenwelt | Technik ► Bauwesen |
Technik ► Elektrotechnik / Energietechnik | |
Technik ► Maschinenbau | |
ISBN-10 | 1-4899-8211-6 / 1489982116 |
ISBN-13 | 978-1-4899-8211-7 / 9781489982117 |
Zustand | Neuware |
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