Reliability of Microtechnology (eBook)

Foreword 6
Preface 8
Contents 10
Introduction to Reliability and Its Importance 16
1.1 Introduction 16
References 17
Reliability Metrology 18
2.1 The Definition of Reliability 18
2.2 Empirical Models 18
2.3 Physical Models 19
2.4 Reliability Information 20
2.5 Interconnection Reliability 24
2.6 The Levels of Interconnections 27
2.7 Reliability Function 28
2.7.1 Exponential Distribution 30
2.7.2 Weibull Distribution 34
2.7.3 Log-Normal Distribution 37
2.7.4 Physical Basis of the Distributions 38
2.8 A Generic Weibull Distribution Model to Predict Reliability of Microsystems 39
2.8.1 Failure-Criteria Dependence of the Location Parameter 41
2.8.2 Least Squares Estimation 42
2.8.3 The Experiment and Data 43
2.8.4 Analysis and the Results 45
2.8.5 Application of the Results 46
Exercises 47
References 48
General Failure Mechanisms of Microsystems 50
3.1 Introduction 50
3.2 Mechanical and Thermomechanical Failure Mechanisms 52
3.2.1 Low Cycle Fatigue 53
3.2.2 Creep 55
3.3 Brittle Fracture 56
3.4 IC Level Failure Mechanisms 56
3.4.1 Electromigration 57
3.4.2 Electrostatic Discharge 58
3.5 Corrosion 60
3.6 Plastic Package Popcorning 61
Exercises 62
References 63
Solder Joint Reliability 64
4.1 Microstructure of Solder Joints 64
4.1.1 Microstructure of Eutectic Sn–37Pb 65
4.1.2 Microstructural Stability and Interfacial Interactions 66
4.1.3 Microstructure of Eutectic Sn–3.5Ag 67
4.1.4 Microstructural Evolution and Interfacial Interactions 67
4.1.5 Microstructure of Sn–Ag–Cu Alloys 68
4.1.6 Microstructural Evolution and Interfacial Interactions 69
4.1.7 Microstructure of Sn–3.5Ag–3Bi 70
4.1.8 Microstructure of Sn–0.7Cu–0.4Co 71
4.2 Mechanical Reliability of Solder Joints 73
4.2.1 Fatigue Failure 74
4.3 General Solder Joint Failure Mechanism 75
4.3.1 Effect of Second Level Solder Interconnection Failure 79
4.3.2 Standards Related to Solder Joint Reliability Testing 81
Exercises 82
References 82
Conductive Adhesive Joint Reliability 85
5.1 Introduction to Conductive Adhesives 85
5.2 Isotropic Conductive Adhesive 86
5.3 Reliability of ICA Interconnects 87
5.3.1 Effect of Metallization 87
5.3.2 Effect of Curing Degree 88
5.3.3 Impact Strength 89
5.3.4 Failure Mechanisms 90
5.3.5 Electron Conduction Through Nanoparticles in ICA 94
5.4 Reliability of ACA Interconnects 95
5.4.1 Effects of Assembly Process 97
5.4.2 Effects of Substrate and Component 99
5.4.3 Degradation Due to Moisture Absorption 101
5.4.4 Oxidation and Crack Growth 102
5.4.5 Probabilities of Open and Bridging 105
5.4.6 ACA Flow During Bonding 107
5.4.7 Electrical Conduction Development and Residual Stresses 108
Exercises 110
References 111
Accelerated Testing 113
6.1 Fatigue Failure Analysis for Accelerated Testing 113
6.2 Thermal Fatigue 114
6.3 Effect of Different Test Factors on Thermal Fatigue Life 116
6.4 Isothermal Mechanical LCF 117
6.4.1 Effect of Frequency 119
6.4.2 Effect of Dwell (Hold) Time 120
6.4.3 Effect of Strain Range and Strain Rate 121
6.4.4 Effect of Temperature 121
6.4.5 Effect of Failure Definition 121
6.4.6 Effect of Other Factors 122
Exercises 123
References 126
Reliability Design for Manufacturability 128
7.1 Lead-Free Soldering 128
7.1.1 Higher Process Temperature 128
7.2 Other Issues 130
7.2.1 Lead Contamination 131
7.2.2 Tin Whiskers 132
7.3 Inspection 133
7.4 Repair and Rework 134
Exercises 134
References 135
Component Reliability 136
8.1 Introduction 136
8.2 Empirical Models 137
8.3 The Methodology 138
8.4 Empirical Models in System Reliability Analysis 139
8.5 Limitations of Empirical Models and Recommendations on Use 140
Exercises 143
References 143
System Level Reliability 145
9.1 Introduction 145
9.2 Some Constant Hazard Rate Approximations of the Weibull Distribution 149
9.3 Resulting Functions and Hazard Rates 152
9.4 Properties of Different Options 155
9.5 Comparison of the Selected Options 157
9.6 Selection of Time Intervals 157
9.7 The Motivation for Selecting Two-Parameter Weibull Distribution 158
9.8 Constant Failure Rate and Its Origin in the Field Failure Data 159
Exercises 159
References 160
Reliability and Quality Management of Microsystem 161
10.1 Introduction 161
10.2 Activity 1: Product Requirements and Constraints 164
10.3 Activity 2: Product Life-Cycle Conditions 164
10.4 Activity 3: Selection and Characterization of Alternative Product Architectures and Manufacturing Processes 165
10.5 Activity 4: Qualification of Packaging Concepts and Manufacturing Processes 166
10.5.1 Manufacturability 167
10.5.2 Reliability 167
10.5.3 Maintainability 173
10.5.4 Environmental Compatibility 173
10.6 Activity 5: Risk Management and Balance of Functionality, Quality, and Cost Requirements 173
10.6.1 Risk Management of Supplied Materials and Parts 174
10.6.2 Risk Management of Manufacturing Processes and New Technologies 174
10.6.3 Failure Modes and Effects Analysis 175
10.6.4 Protective Measures 175
10.7 Activity 6: Quality Controls and Improvement of Design, Materials, Parts, and Manufacturing Processes 175
10.7.1 Design Defects 176
10.7.2 Defects Caused by Manufacturing Processes 177
10.8 Activity 7: Failure Analysis and Feedback of Gained Knowledge 179
Exercises 179
References 180
Experimental Tools for Reliability Analysis 181
11.1 Optical Microscopy 181
11.2 Scanning Electron Microscopy 181
11.3 Energy-Dispersive X-Ray 182
11.4 Scanning Acoustic Microscopy 182
11.5 X-Ray 183
11.6 Low-Cycle Fatigue Testing 184
11.7 Shear Testing 184
11.8 Humidity and Temperature Testing 186
11.9 Thermal Shock and Thermal Cycling Testing 187
11.10 Moire Interferometry 188
Exercises 191
References 192
Abbreviations 193
Answers to the Exercises 195
Chapter 2 195
Chapter 3 197
Chapter 4 200
Chapter 5 201
Chapter 6 203
Chapter 7 209
Chapter 8 210
Chapter 9 210
Chapter 10 211
Chapter 11 212
Index 213