Thermal Management of Electronic Systems

1. Invited Lectures.- Thermal management of air-cooled electronic systems: New challenges for research.- Analysis and prevention of thermally induced failures in electronic equipment.- 2. Numerical and Experimental Analysis of Systems.- Computational analysis of air and heat flow in electronic systems.- Thermal analysis of a telecommunications rack system.- Supporting experiments for CFD based thermal design of telecommunication equipment.- Two complementary approaches for the thermal simulation of electronic equipment.- Some considerations on practical formulas used for thermal design of natural ventilated enclosures.- 3. Numerical and Experimental Analysis of Channels.- Natural convection in a rectangular enclosure with an array of chips mounted on a vertical wall.- Differences between 2D and 3D models predictions in a channel with a dissipating obstacle.- Effect of radiation on natural convection in tilted channels.- 4. Numerical and Experimental Analysis of Electronic Parts.- Thermal study of a laser diode using a finite element method associated with a meshing superimposition method.- Computer-aided optimization of electrothermal CMOS-compatible infrared sensors.- Mixed convection and heat transfer on vertical parallel printed circuit boards.- A parametric study of heat spreading through multiple layer substrates.- Thermal drift effects in power microwave hybrid circuits.- Computational modelling of wafer cooldown in a staging module.- 5. Measurement Techniques.- Recent innovations in thermal technology instrumentation applied to materials used in electronic applications.- An experimental method to determine the effective thermal conductivity of printed circuit boards.- Air velocity and temperature measurements around a naturally convecting rectangular fin array.-6. Liquid Cooling of Electronic Devices.- Application and performance of Si-microcooling systems for electronic devices.- Temperature controlled measurements of the critical heat flux on microelectronic heat sources in natural convection and jet impingement cooling.- Pool boiling heat transfer of dielectric fluids for immersion electronic cooling: effects of pressure.- 7. Thermal Characterization of Electronic Parts.- Thermal design of a 419 pins ceramic Pin Grid Array package.- Design of an optimal heat-sink geometry for forced convection air cooling of multi-chip modules.- Thermal characterization and design for high performance multichip module type laminate.- The thermal characteristics of a board-mounted 160 lead plastic quad flat pack.- Investigation of die attach integrity using transient thermal analysis techniques.- 8. Thermal Stress and Die Attach Defects.- Thermal stress in convectively-cooled plastic-encapsulated chip packages.- Impact of die attach defects on internal temperature of power hybrids.- Author Index.