Modeling and Simulation of High Speed VLSI Interconnects
Springer-Verlag New York Inc.
978-1-4613-6171-8 (ISBN)
Modeling and Simulation of High Speed VLSI Interconnects serves as an excellent reference, providing insight into some of the most important issues in the field.
Guest Editors’ Introduction.- Efficient Transient Analysis of Nonlinearly Loaded Low-Loss Multiconductor Interconnects.- A Simplified Synthesis of Transmission Lines with a Tree Structure.- An Interconnect Model for Arbitrary Terminations Based on Scattering Parameters.- Electromagnetic Analysis of Multiconductor Losses and Disperion in High-Speed Interconnects.- Circuit Modeling of General Hybrid Uniform Waveguide Structures in Chiral Anisotropic Inhomogeneous Media.- An Efficient, CAD-Oriented Model for the Characteristic Parameters of Multiconductor Buses in High-Speed Digital GaAs ICs.- Full-Wave Analysis of Radiation Effect of Microstrip Transmission Lines.- Optimizing VLSI Interconnect Model for SPICE Simulation.- Statistical Simulation and Optimization of High-Speed VLSI Interconnects.
Zusatzinfo | 108 p. |
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Verlagsort | New York, NY |
Sprache | englisch |
Maße | 195 x 260 mm |
Themenwelt | Mathematik / Informatik ► Informatik ► Theorie / Studium |
Technik ► Elektrotechnik / Energietechnik | |
ISBN-10 | 1-4613-6171-0 / 1461361710 |
ISBN-13 | 978-1-4613-6171-8 / 9781461361718 |
Zustand | Neuware |
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