Semiconductor Manufacturing Handbook

Hwaiyu Geng, CMfgE, P.E. (Palo Alto, California) is a Project Manager of Corporate REWS at Hewlett-Packard Company. His experience in manufacturing engineering is diverse, including work at Applied Materials and Hewlett-Packard’s high-tech industries. He has faced many of the challenges facing engineers today, having designed manufacturing processes and facilities for new products, implemented automated manufacturing systems, and established quality, safety, and maintenance programs. He is a Certified Manufacturing Engineer by the Society of Manufacturing Engineers and a Professional Engineer in the State of California. Mr. Geng is also the author of McGraw-Hill's Manufacturing Engineering Handbook.

PART 1: Semiconductor Fundamentals and Basic Materials
BOARD OF REVIEWERS
CONTRIBUTORS
PREFACE
ACKNOWLEDGMENTS
Chapter 1: How Semiconductor Chips Are Made - Hwaiyu Geng, Lin Zhou
Chapter 2: IC Design - Ilsun Park
Chapter 3: Silicon Substrates for Semiconductor Manufacturing - K.V. Ravi
Chapter 4: Copper, Low-k Dielectrics, and Their Reliability - Hazara S. Rathore, Kaushik Chanda
Chapter 5: Fundamentals-Silicide Formation on Si - L.P. Ren, King N. Tu
Chapter 6: Plasma Process Control - David J. Coumou
Chapter 7: Vacuum Technology - Peter Biltoft
Chapter 8: Photomask - Charles Howard
PART 2: Wafer Processing
Chapter 9: Microlithography - Chris A. Mack
Chapter 10: Ion Implantation and Rapid Thermal Processing - Michael Graf
Chapter 11: Wet Etching - Peng Zhang
Chapter 12: Plasma Etching - Shouliang Lai
Chapter 13: Physical Vapor Deposition - Florian Solzbacher
Chapter 14: Chemical Vapor Deposition - Edward J. McInerney
Chapter 15: Epitaxy - Jamal Ramdani, Giovanni Vaccari
Chapter 16: ECD Fundamentals - Tom Ritzdorf, John Klocks
Chapter 17: Chemical Mechanical Planarization - Timothy S. Dyer
Chapter 18: Wet Cleaning - Andrew Machamer
Part 3: Final Manufacturing
Chapter 19: Inspection, Measurement, and Test - Donald W. Blair
Chapter 20: Grinding, Stress Relief, and Dicing - Kazuhisa Arai, Yoshikazu Kobayashi, Hideaki Otani
Chapter 21: Packaging - Dietrich Tonnies, Michael Topper
Part 4: Nanotechnology, MEMS, and FPD
Chapter 22: Nanotechnology and Nanomanufacturing - Zhong L. Wang
Chapter 23: Fundamentals of Microelectromechanical Systems - Michael A. Huff
Chapter 24: Flat-Panel Display Technology and Manufacturing - David N. Liu
Part 5: Gases and Chemicals
Chapter 25: Specialty Gas and CDA Systems - Wayne D. Curcie
Chapter 26: Waste Gas Abatement Systems - Joseph D. Sweeney
Chapter 27: PFC Abatement - James C. Cox
Chapter 28: Chemical and Slurry Handling Systems - Kristin Cavicchi, Dan Barsness
Chapter 29: Fluid Handling Components for High Purity Liquid Chemicals and Slurries - Charles K. Gould
Chapter 30: Fundamentals of Ultrapure Water - David J. Albrecht
Part 6: Fab Yield, Operations, and Facilities
Chapter 31: Yield Management - Bo Li, Wayne Carriker
Chapter 32: Automated Material Handling System - Clint Harris
Chapter 33: CD Metrology and CD-SEM - Ram Peltinov, Mina Menaker
Chapter 34: Six Sigma - Bruno Scibilia, Yoan Dupret
Chapter 35: Advanced Process Control - Robert H. McCafferty
Chapter 36: Environmental, Health, and Safety (EHS) Considerations in Semiconductor Fabrication Facilities - Brett J. Davis, Steven R. Trammell
Chapter 37: Plan, Design, and Construction of a FAB - Industrial Design and Construction
Chapter 38: Cleanroom Design and Construction - Richard V. Pavlotsky, Stephen C. Beck
Chapter 39: Micro-Vibration and Noise Design - Michael Gandreau, Hal Amick
Chapter 40: ESD Controls in Cleanroom Environments - Larry Levit
Chapter 41: Airborne Molecular Contamination - Chris Muller
Chapter 42: Particle Monitoring in Semiconductor Manufacturing - Steven Kochevar, Jerry Gromala
Chapter 43: Wastewater Neutralization Systems - Richard E. Pinkowski
APPENDIX
INDEX