Semiconductor Manufacturing Handbook, Second Edition
Seiten
2017
|
2nd edition
McGraw-Hill Education (Verlag)
978-1-259-58769-6 (ISBN)
McGraw-Hill Education (Verlag)
978-1-259-58769-6 (ISBN)
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Fully updated, state-of-the-art semiconductor design and manufacturing information
This fully updated handbook provides cutting-edge technologies and state-of-the-art processes needed to design and fabricate IC chips, MEMS, sensors, and other electronic devices. The book lays out the electronics fundamentals and techniques that are required to understand and accelerate the pace of innovation.
Semiconductor Manufacturing Handbook, Second Edition consolidates many complex engineering and manufacturing disciplines into one volume, enabling the quick look up of specific reference data. Readers will get complete details on semiconductor fundamentals and basic materials, front-end of line processes, back-end of line processes, nanotechnology, MEMS, photovoltaics, gases and chemicals, and fab yield, operations and facilities.
Covers the breadth and width of emerging technologies and manufacturing processes that enable big data, the Internet of Things, and smart manufacturingFully explains global regulations and environmental requirementsWritten by 50 international experts and reviewed by a seasoned advisory board
This fully updated handbook provides cutting-edge technologies and state-of-the-art processes needed to design and fabricate IC chips, MEMS, sensors, and other electronic devices. The book lays out the electronics fundamentals and techniques that are required to understand and accelerate the pace of innovation.
Semiconductor Manufacturing Handbook, Second Edition consolidates many complex engineering and manufacturing disciplines into one volume, enabling the quick look up of specific reference data. Readers will get complete details on semiconductor fundamentals and basic materials, front-end of line processes, back-end of line processes, nanotechnology, MEMS, photovoltaics, gases and chemicals, and fab yield, operations and facilities.
Covers the breadth and width of emerging technologies and manufacturing processes that enable big data, the Internet of Things, and smart manufacturingFully explains global regulations and environmental requirementsWritten by 50 international experts and reviewed by a seasoned advisory board
Hwaiyu Geng (Palo Alto, CA) is Manager of Corporate Project Planning and Management for the Hewlett Packard Corporation. He managed the design and construction HPs Inkjet manufacturing facility in Shanghai, China.
Erscheinungsdatum | 30.01.2018 |
---|---|
Zusatzinfo | 400 Illustrations, unspecified |
Verlagsort | OH |
Sprache | englisch |
Maße | 216 x 262 mm |
Gewicht | 1352 g |
Themenwelt | Technik ► Elektrotechnik / Energietechnik |
Technik ► Maschinenbau | |
ISBN-10 | 1-259-58769-X / 125958769X |
ISBN-13 | 978-1-259-58769-6 / 9781259587696 |
Zustand | Neuware |
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