Handbook of Thin Film Deposition

Dominic Schepis has over 35 years in the semiconductor industry supporting logic and memory technologies. As Principal Member of the Technical Staff at GlobalFoundries, Dominic worked on process development and integration for various advanced node CMOS technologies. His early work on SOI CMOS integration was instrumental to bringing this technology for use in IBM servers. He also was appointed Master Inventor at both IBM and Globalfoundries and served on their patent evaluation boards. A graduate from Rensselaer Polytechnic Institute, he joined IBM’s Semiconductor Research and Development Center (SRDC) and has worked on a variety of advanced research and development projects and supported process sectors including reactive ion etching, epitaxial film growth, process integration, and other unit processes. During his tenure there, he co-authored over 29 technical journal papers and has over 100 issued US patents. Former Assistant Professor in Materials Science at the University of Arizona with extensive professional experience as a technologist at both IBM and Intel Corporations. Dr. Seshan passed away in 2017.

1. Introduction: Challenges and Future Directions in Nanotechnology

Part I Reduction to Practice
2. Process Integration for On-Chip Interconnects
3. Sputter Processing
4. Epitaxial Thin Film Growth
5. CVD Processing and Processes
6. CMP: Scaling Down and Stacking Up: How the Trends in Semiconductors are Affecting Chemical-Mechanical Planarization
7. Limits of Gate Dielectric Scaling

Part II Applications and Limitations
8. Reliability Considerations for Thin Film Devices
9. Thin Film Development for LED Technologies
10. Ferroelectric Thin Films: Applications and Processing Considerations
11. Applications of Thin Film in Semiconductor Memories
12. Yield Issues and Defect Density in Thin Films