A Survey on 3D Cameras: Metrological Comparison of Time-of-Flight, Structured-Light and Active Stereoscopy Technologies
Seiten
2018
|
1st ed. 2018
Springer International Publishing (Verlag)
978-3-319-91760-3 (ISBN)
Springer International Publishing (Verlag)
978-3-319-91760-3 (ISBN)
This book is a valuable resource to deeply understand the technology used in 3D cameras. In this book, the authors summarize and compare the specifications of the main 3D cameras available in the mass market. The authors present a deep metrological analysis of the main camera based on the three main technologies: Time-of-Flight, Structured-Light and Active Stereoscopy, and provide qualitative results for any user to understand the underlying technology within 3D camera, as well as practical guidance on how to get the most of them for a given application.
Erscheinungsdatum | 29.06.2018 |
---|---|
Reihe/Serie | SpringerBriefs in Computer Science |
Zusatzinfo | IX, 90 p. 101 illus., 88 illus. in color. |
Verlagsort | Cham |
Sprache | englisch |
Maße | 155 x 235 mm |
Gewicht | 165 g |
Themenwelt | Informatik ► Grafik / Design ► Digitale Bildverarbeitung |
Informatik ► Theorie / Studium ► Künstliche Intelligenz / Robotik | |
Technik ► Elektrotechnik / Energietechnik | |
Schlagworte | 3D camera • accuracy • Assessment • BIPM • characterization • GuM • Intel RealSense • Kinect V2 • Metrology • Orbbec Astra • Performance Assessment • Precision • Qualification • stereoscopy • Structured-Light • Survey • time-of-flight • Uncertainty |
ISBN-10 | 3-319-91760-9 / 3319917609 |
ISBN-13 | 978-3-319-91760-3 / 9783319917603 |
Zustand | Neuware |
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