Molecular Modeling and Multiscaling Issues for Electronic Material Applications

Volume 2

Artur Wymyslowski, Nancy Iwamoto, Matthew Yuen, Haibo Fan (Herausgeber)

Buch | Softcover

X, 194 Seiten

2016 | 1. Softcover reprint of the original 1st ed. 2015
Springer International Publishing (Verlag)
978-3-319-36666-1 (ISBN)

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This book offers readers a snapshot of the progression of molecular modeling in the electronics industry and how molecular modeling is currently being used to understand materials to solve relevant issues in this field. The reader is introduced to the evolving role of molecular modeling, especially seen from the perspective of the IEEE community and modeling in electronics. This book also covers the aspects of molecular modeling needed to understand the relationship between structures and mechanical performance of materials. The authors also discuss the transitional topic of multiscale modeling and recent developments on the atomistic scale and current attempts to reach the submicron scale, as well as the role that quantum mechanics can play in performance prediction.

Molecular Modeling of pH-Dependent Properties of Emeraldine Base Polyaniline for pH-Based Chemical Sensors.- Two Approaches of Study Cu/Epoxy Interface Enhancement with Benzenethiol Promoter.- Molecular Dynamics Simulation of Pore Formation Mechanism for Deposition of Poly (vinylidene fluoride-co-trifluoroethylene) on Gold Substrate.- Investigating the Influence of Moisture by Molecular Dynamics Simulations.- Analysis of the Adhesion Work with a Molecular Modeling Method and a Wetting Angle Measurement.- Using Coarse-Grained Molecular Models (Molecular-Mesocale) of a Copper Oxide-Epoxy Interface to Obtain Stress-Strain Failure Predictions which Include Interfacial Roughness, Water and Filler Effects.- Establishment of the Mesoscale Parameters for Separation: A Non-Equilibrium Molecular Dynamics Model.- Mechanics of Graphene and Carbon Nanotubes under Uniaxial Compression and Tension.- Analysis of an Influence of a Conversion Level on Simulation Results of the Crosslinked Polymers.

Erscheinungsdatum	16.09.2016
Zusatzinfo	X, 194 p. 153 illus., 77 illus. in color.
Verlagsort	Cham
Sprache	englisch
Maße	155 x 235 mm
Themenwelt	Technik ► Elektrotechnik / Energietechnik
Themenwelt	Technik ► Maschinenbau
Schlagworte	Atomistic scale • Continuum Mechanics and Mechanics of Materials • Electronic devices and materials • Electronic materials • Electronics and Microelectronics, Instrumentation • Electronics engineering • Engineering • Engineering: general • Mechanical engineering and materials • Molecular Modeling • multiscale modeling • nanoscale science and technology • nanotechnology • optical and electronic materials • quantum mechanics
ISBN-10	3-319-36666-1 / 3319366661
ISBN-13	978-3-319-36666-1 / 9783319366661
Zustand	Neuware