Molecular Modeling and Multiscaling Issues for Electronic Material Applications
Springer International Publishing (Verlag)
978-3-319-12861-0 (ISBN)
Molecular Modeling of pH-Dependent Properties of Emeraldine Base Polyaniline for pH-Based Chemical Sensors.- Two Approaches of Study Cu/Epoxy Interface Enhancement with Benzenethiol Promoter.- Molecular Dynamics Simulation of Pore Formation Mechanism for Deposition of Poly (vinylidene fluoride-co-trifluoroethylene) on Gold Substrate.- Investigating the Influence of Moisture by Molecular Dynamics Simulations.- Analysis of the Adhesion Work with a Molecular Modeling Method and a Wetting Angle Measurement.- Using Coarse-Grained Molecular Models (Molecular-Mesocale) of a Copper Oxide-Epoxy Interface to Obtain Stress-Strain Failure Predictions which Include Interfacial Roughness, Water and Filler Effects.- Establishment of the Mesoscale Parameters for Separation: A Non-Equilibrium Molecular Dynamics Model.- Mechanics of Graphene and Carbon Nanotubes under Uniaxial Compression and Tension.- Analysis of an Influence of a Conversion Level on Simulation Results of the Crosslinked Polymers.
Erscheint lt. Verlag | 3.12.2014 |
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Zusatzinfo | X, 194 p. 153 illus., 77 illus. in color. |
Verlagsort | Cham |
Sprache | englisch |
Maße | 155 x 235 mm |
Gewicht | 473 g |
Themenwelt | Technik ► Elektrotechnik / Energietechnik |
Technik ► Maschinenbau | |
Schlagworte | Atomistic scale • Electronic materials • Molecular Modeling • multiscale modeling • quantum mechanics |
ISBN-10 | 3-319-12861-2 / 3319128612 |
ISBN-13 | 978-3-319-12861-0 / 9783319128610 |
Zustand | Neuware |
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