Design for Manufacturability
From 1D to 4D for 90–22 nm Technology Nodes
Seiten
2013
Springer-Verlag New York Inc.
978-1-4614-1760-6 (ISBN)
Springer-Verlag New York Inc.
978-1-4614-1760-6 (ISBN)
This book explains integrated circuit design for manufacturability (DfM) at the product level (packaging, applications) and applies engineering DfM principles to the latest standards of product development at 22 nm technology nodes. It is a valuable guide for layout designers, packaging engineers and quality engineers, covering DfM development from 1D to 4D, involving IC design flow setup, best practices, links to manufacturing and product definition, for process technologies down to 22 nm node, and product families including memories, logic, system-on-chip and system-in-package.
Artur Balasinski is a Technology Design Integration Manager for Cypress Semiconductor in San Jose, California.
Preface.- Classic DfM: from 2D to 3D.- DfM at 28 nm and Beyond.- New DfM Domain: Stress Effects.- Conclusions and Future Work.
Erscheint lt. Verlag | 6.10.2013 |
---|---|
Zusatzinfo | 45 Illustrations, color; 169 Illustrations, black and white; VIII, 278 p. 214 illus., 45 illus. in color. |
Verlagsort | New York, NY |
Sprache | englisch |
Maße | 155 x 235 mm |
Themenwelt | Technik ► Bauwesen |
Technik ► Elektrotechnik / Energietechnik | |
Technik ► Maschinenbau | |
Schlagworte | 22nm technology node DFM • 3D Design for manufacturability • design for manufacturability • DFM • Integrated Circuits • Memory Design for manufacturability • Produktdesign • Produktentwicklung • System in Package • System on chip • X-fab manufacturability |
ISBN-10 | 1-4614-1760-0 / 1461417600 |
ISBN-13 | 978-1-4614-1760-6 / 9781461417606 |
Zustand | Neuware |
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