Advances in CMP Polishing Technologies -

Advances in CMP Polishing Technologies

Buch | Hardcover
328 Seiten
2011
William Andrew Publishing (Verlag)
978-1-4377-7859-5 (ISBN)
168,35 inkl. MwSt
CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. This title presents the developments and technological innovations in the field - making R&D accessible to the wider engineering community.
CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field – making cutting-edge R&D accessible to the wider engineering community.

Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience.

Building on the fundamentals of tribology – the science of friction, wear and lubrication – the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries.

Ioan D. Marinescu is Professor and Director of the Precision Micromachining Center at The University of Toledo, Ohio, USA, and CEO of Advanced Manufacturing Solutions, LLC. His research interests include manufacturing processes, grinding, tribology, advanced materials, and machining of brittle materials.

Chapter 1: Introduction

Chapter 2: Device fabrication with a silicon crystal substrate

Chapter 3: Ultra-precision technology – taking silicon single crystal as an example

Chapter 4: Applications of ultra-precision CMP in device processes

Chapter 5: The future of processing technology

Chapter 6: Progress of the semiconductor and silicon industries

Chapter 7: Summary

Erscheint lt. Verlag 20.12.2011
Verlagsort Norwich
Sprache englisch
Maße 152 x 229 mm
Gewicht 550 g
Themenwelt Technik Elektrotechnik / Energietechnik
Technik Maschinenbau
Technik Umwelttechnik / Biotechnologie
ISBN-10 1-4377-7859-3 / 1437778593
ISBN-13 978-1-4377-7859-5 / 9781437778595
Zustand Neuware
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