Microelectronics Packaging Handbook, 3-part set
Chapman and Hall (Verlag)
978-0-412-08461-4 (ISBN)
Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development.
Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail.
Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.
Part I: Foreword. Preface. Conversion Factors. Summary Contents. 1. Microelectronics packaging: An overview. 2. Package wiring and terminals. 3. Package electrical design. 4. Heat transfer in electronic packages. 5. Package reliability. 6. Package manufacture. Glossary and Symbols. Authors' Biographies. Index. Part II: 7. Microelectronics packaging: An overview. 8. Chip-to-package interconnection. 9. Ceramic packaging. 10. Plastic packaging. 11. Polymers in packaging. 12. Thin-film packaging. 13. Package electrical testing. 14. Package sealing and encapsulation. Part III: 15. Microelectronics packaging: An overview. 16. Package-to-board interconnections. 17. Printed-wiring board packaging. 18. Coated-metal packaging. 19. Connector and cable packaging. 20. Packaging of optoelectronics with electronics.
Erscheint lt. Verlag | 31.1.1997 |
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Reihe/Serie | Microelectronics Packaging Handbook, 3-part set | 1.10 |
Zusatzinfo | 3 volume-set. |
Verlagsort | London |
Sprache | englisch |
Themenwelt | Schulbuch / Wörterbuch ► Lexikon / Chroniken |
Informatik ► Theorie / Studium ► Algorithmen | |
Informatik ► Weitere Themen ► Hardware | |
Technik ► Elektrotechnik / Energietechnik | |
Technik ► Maschinenbau | |
ISBN-10 | 0-412-08461-9 / 0412084619 |
ISBN-13 | 978-0-412-08461-4 / 9780412084614 |
Zustand | Neuware |
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