Electrothermal Analysis of VLSI Systems -  Yi-Kan Cheng,  Ching-Han Tsai,  Chin-Chi Teng,  Sung-Mo (Steve) Kang

Electrothermal Analysis of VLSI Systems

Buch | Softcover
210 Seiten
2013
Springer-Verlag New York Inc.
978-1-4757-7373-6 (ISBN)
106,99 inkl. MwSt
Electrothermal Analysis of VLSI Systems addresses electrothermal problems in modern VLSI systems.
Part I, The Building Blocks, discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires (including power analysis, temperature-dependent device modeling, thermal/electrothermal simulation, and experimental setup-calibration).
Part II, The Applications, discusses three important applications of VLSI electrothermal analysis including temperature-dependent electromigration diagnosis, cell-level thermal placement and temperature-driven power and timing analysis.
Electrothermal Analysis of VLSI Systems will be useful for researchers in the fields of IC reliability analysis and physical design, as well as VLSI designers and graduate students.

The Building Blocks.- Power Analysis for CMOS Circuits.- Temperature-dependent MOS Device Modeling.- Thermal Simulation for VLSI Systems.- Fast-timing Electrothermal Simulation.- The Applications.- Temperature-dependent Electromigration Reliability.- Temperature-driven Cell Placement.- Temperature-driven Power and Timing Analysis.

Erscheint lt. Verlag 20.4.2013
Zusatzinfo 36 Illustrations, black and white; XXIII, 210 p. 36 illus.
Verlagsort New York, NY
Sprache englisch
Maße 155 x 235 mm
Themenwelt Mathematik / Informatik Informatik Theorie / Studium
Mathematik / Informatik Mathematik Analysis
Naturwissenschaften Physik / Astronomie Thermodynamik
Technik Elektrotechnik / Energietechnik
ISBN-10 1-4757-7373-0 / 1475773730
ISBN-13 978-1-4757-7373-6 / 9781475773736
Zustand Neuware
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