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Building Fun Programs, Games, and Electronic Projects
von Bob Dukish
Buch | Softcover
2018 | Apress
ISBN: 9781484235096
64,19 (inkl. MwSt)
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Automate management, scaling, and deployment of containerized applications, 2nd Edition
von Nills Franssens; Shivakumar Gopalakrishnan; Gunther..
Buch | Softcover
2020 | Packt Publishing Limited
ISBN: 9781800209671
44,85 (inkl. MwSt)
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27th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2019, Cusco, Peru, October 6–9, 2019, Revised and Extended..
von Carolina Metzler; Pierre-Emmanuel Gaillardon;..
Buch | Hardcover
2020 | Auflage: 1 | Springer International Publishing
ISBN: 9783030532727
106,99 (inkl. MwSt)
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Implementing edge and IoT systems from sensors to clouds with communication systems, analytics, and security, 2nd Edition
von Perry Lea
Buch | Softcover
2020 | Packt Publishing Limited
ISBN: 9781839214806
44,85 (inkl. MwSt)
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First International Conference, SPBPU IDE 2019, St. Petersburg, Russia, October 24–25, 2019, Revised Selected Papers
von Dmitrii Rodionov; Tatiana Kudryavtseva; Mohammed..
Buch | Softcover
2020 | Auflage: 1 | Springer International Publishing
ISBN: 9783030600792
80,24 (inkl. MwSt)
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First International Workshop in memory of Prof. Raffaele Santamaria on R3 in Geomatics: Research, Results and Review, R3GEO 2019, Naples, Italy,..
von Claudio Parente; Salvatore Troisi; Antonio Vettore
Buch | Softcover
2020 | Auflage: 1 | Springer International Publishing
ISBN: 9783030627997
53,49 (inkl. MwSt)
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10th EAI International Conference, MONAMI 2020, Chiba, Japan, November 10–12, 2020, Proceedings
von Seng W. Loke; Zhi Liu; Kien Nguyen; Guoming Tang;..
Buch | Softcover
2020 | Auflage: 1 | Springer International Publishing
ISBN: 9783030640019
74,89 (inkl. MwSt)
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23rd International Workshop, JSSPP 2020, New Orleans, LA, USA, May 22, 2020, Revised Selected Papers
von Dalibor Klusáček; Walfredo Cirne; Narayan Desai
Buch | Softcover
2020 | Auflage: 1 | Springer International Publishing
ISBN: 9783030631703
53,49 (inkl. MwSt)
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Create secure, scalable, high-availability applications on the cloud, 3rd Edition
von Ritesh Modi; Jack Lee; Rithin Skaria
Buch | Softcover
2020 | Packt Publishing Limited
ISBN: 9781839215865
49,85 (inkl. MwSt)
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15th International Symposium, ISVC 2020, San Diego, CA, USA, October 5–7, 2020, Proceedings, Part II
von George Bebis; Zhaozheng Yin; Edward Kim; Jan..
Buch | Softcover
2020 | Auflage: 1 | Springer International Publishing
ISBN: 9783030645588
106,99 (inkl. MwSt)
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