Materials for Advanced Packaging
Springer-Verlag New York Inc.
978-0-387-78218-8 (ISBN)
3D Integration Technologies – An Overview.- Advanced Bonding/Joining Techniques.- Advanced Chip-to-Substrate Connections.- Advanced Wire Bonding Technology: Materials, Methods, and Testing.- Lead-Free Soldering.- Thin Die Production.- Advanced Substrates: A Materials and Processing Perspective.- Advanced Print Circuit Board Materials.- Flip-Chip Underfill: Materials, Process and Reliability.- Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips.- Electrically Conductive Adhesives (ECAs).- Die Attach Adhesives and Films.- Thermal Interface Materials.- Embedded Passives.- Nanomaterials and Nanopackaging.- Wafer Level Chip Scale Packaging.- Microelectromechanical Systems and Packaging.- LED and Optical Device Packaging and Materials.- Digital Health and Bio-Medical Packaging.
Erscheint lt. Verlag | 10.12.2008 |
---|---|
Zusatzinfo | 300 Illustrations, black and white; XII, 724 p. 300 illus. |
Verlagsort | New York, NY |
Sprache | englisch |
Maße | 155 x 235 mm |
Themenwelt | Technik ► Elektrotechnik / Energietechnik |
Technik ► Maschinenbau | |
ISBN-10 | 0-387-78218-4 / 0387782184 |
ISBN-13 | 978-0-387-78218-8 / 9780387782188 |
Zustand | Neuware |
Haben Sie eine Frage zum Produkt? |
aus dem Bereich