Handbook of 3D Integration

Dr. Philip Garrou is a consultant in the field of thin film microelectronic materials and applications, prior to which he was Director of Technology and New Business Development for Dow Chemicals' Advanced Electronic Materials business. He has authored two microelectronics texts and is co-author of over 75 peer reviewed publications and book chapters. Dr. Christopher A. Bower is Senior Research Scientist at Semprius Inc., Durham, NC, where he works on the heterogeneous integration of compound semiconductors with silicon integrated cirucits. He previously held positions at Inplane Photonics as a senior process development engineer and as a scientist at RTI International, where he served as the technical lead on multiple DARPA-funded 3D integration programs. Dr. Bower has authored or co-authored over 40 peer-reviewed publications and holds 2 U.S. patents. Dr. Peter Ramm is head of the silicon technology department of the Fraunhofer Institute for Reliability and Microintegration (IZM) in Munich, Germany, where he is responsible for process integration of innovative devices and new materials. He received his Ph.D. in physics from the University of Regensburg and subsequently worked for Siemens before joining the Fraunhofer Institute for Solid State Technology (IFT) in Munich in 1988. He is the author or co-author of more than 50 papers and 20 patents.

INTRODUCTION TO 3D INTEGRATIONDRIVER FOR 3D INTEGRATION
Overview of 3D Processing Technology
Fabrication of Through Silicon Vias (TSV)
Fabrication, Processing and Singulation of Thin Wafers
Wafer and Die Bonding Technology

3D INTEGRATION PROCESSES
Universities and InstitutesStart Up Companies
3D Commerical Roadmaps

DESIGN FOR 3D INTEGRATION
NC State
Fraunhofer
U Minn

ELECTRICAL PERFORMANCE AND TEST OF 3D CIRCUITS
Electrical Performance - Infineon
Test of 3D Circuits - Intel

THERMAL MANAGEMANT
Fraunhofer IZM
IBM Zurich

APPLICATION OF 3D INTEGRATION
3D Integratio for Next Generation Microprocessors
3D Memories
Sensor Arrays
TSV for Power Devices

CONCLUSIONS