Printed Circuits Handbook
McGraw-Hill Professional (Verlag)
978-0-07-146734-6 (ISBN)
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The World's #1 Guide to Printed Circuit Boards_Now Completely Updated with the Latest Information on Lead-Free Manufacturing! The best reference in the field for over 30 years, the Printed Circuits Handbook equips you with definitive coverage of every facet of printed circuit assemblies_from design methods to fabrication processes. Now completely revised and updated, the Sixth Edition presents the latest information on lead-free manufacturing, including lead-free PCB design and fabrication techniques, lead-free materials, and lead-free reliability models. The new edition also explores best practices for High Density Interconnect (HDI), as well as flexible printed circuits. Written by a team of experts from around the world, the Sixth Edition of this renowned handbook contains cutting-edge material on engineering and design of printed circuits fabrication methods!assembly processes! solders and soldering!test and repair!waste minimization and treatment !quality and reliability of printed circuit processes!and much more.
The updated Printed Circuits Handbook provides you with: Unsurpassed guidance on printed circuits_from design to manufacturing Over 500 illustrations, charts, and tables for quick access to essential data New to this edition: New coverage of lead-free PCB design and manufacturing techniques, lead-free materials, lead-free reliability models, best practices for High Density Interconnect (HDI), and flexible printed circuits Inside This State-of-the-Art Printed Circuits Guide / Introduction to Printed Circuits / Engineering and Design of Printed Circuits Fabrication Processes / Assembly Processes / Solders and Soldering / Test and Repair / Waste Minimization and Treatment / Quality and Reliability of Printed Circuit Processes / Flexible Circuits
Clyde F. Coombs, Jr. (Los Altos, CA) recently retired from Hewlett-Packard. He is the editor of all five editions of the Printed Circuits Handbook, the first of which was published in 1967. He is also the editor of two editions of the Electronic Instrument Handbook.
List of Contributors Preface Part 1: Lead-Free Legislation Chapter 1: Legislation and Impact on Printed Circuits Part 2: Printed Circuit Technology Drivers Chapter 2: ELECTRONIC PACKAGING AND HIGH-DENSITY INTERCONNECTIVITY Chapter 3: Semiconductor Packaging Technology Chapter 4: Advanced Component Packaging Chapter 5: Types of Printed Wiring Boards Part 3: Materials Chapter 6: Introduction to Base Materials Chapter 7: Base Material Components Chapter 8: Properties of Base Materials Chapter 9: Base Materials Performance Issues Chapter 10: The Impact of Lead-Free Assembly on Base Materials Chapter 11: Selecting Base Materials for Lead-Free Assembly Applications Chapter 12: Laminate Qualification and Testing Part 4: Engineering and Design Chapter 13: Physical Characteristics of the PCBM Chapter 14: The PCB Design Process Chapter 15: Electrical and Mechanical Design Parameters Chapter 16: Current Carrying Capacity in Printed Circuits Chapter 17: PCB Design for Thermal Performance Chapter 18: Information Formatting and Exchange Chapter 19: Planning for Design, Fabrication, and Assembly Chapter 20: Manufacturing Information, Documentation, and Transfer Including CAM Tooling for Fab and Assembly Chapter 21: Embedded Components Part 5: High Density Interconnection Chapter 22: Introduction to High-Density Interconnection (HDI) Technology Chapter 23: Advanced High-Density Interconnection (HDI) Technologies Part 6: Fabrication Chapter 24: Drilling Processes Chapter 25: Precision Interconnect Drilling Chapter 26: Imaging Chapter 27: Multilayer Materials and Processing Chapter 28: Preparing Boards for Plating Chapter 29: Electroplating Chapter 30: Direct Plating Chapter 31: PWB Manufacture Using Fully Electroless Copper Chapter 32: Printed Circuit Board Surface Finishes Chapter 33: Solder Mask Chapter 34: Etching Process and Technologies Chapter 35: Machining and Routing Part 7: Bare Board Test Chapter 36: Bare Board Test Objectives and Definitions Chapter 37: Bare Board Test Methods Chapter 38: Bare Board Test Equipment Chapter 39: HDI Bare Board Special Testing Methods Part 8: Assembly Chapter 40: Assembly Processes Chapter 41: Conformal Costing Part 9: Solderability Technology Chapter 42: Solderability: Incoming Inspection and Wet Balance Technique Chapter 43: Fluxes and Cleaning Part 10: Solder Materials and Processes Chapter 44: Soldering Fundamentals Chapter 45: Soldering Materials and Metallurgy Chapter 46: Solder Fluxes Chapter 47: Soldering Techniques Chapter 48: Soldering Repair and Rework Part 11: Nonsolder Interconnection Chapter 49: Press-Fit Interconnection Chapter 50: Land Grid Array Interconnect Part 12: Quality Chapter 51: Acceptability and Quality of Fabricated Boards Chapter 52: Acceptability of Printed Circuit Board Assemblies Chapter 53: Assembly Inspection Chapter 54: Design for Testing Chapter 55: Loaded Board Testing Part 13: Reliability Chapter 56: Conductive Anodic Filament Formation Chapter 57: Reliability of Printed Circuit Assemblies Chapter 58: Component-to-PWB Reliability: The Impact of Design Variables and Lead Free Chapter 59: Component-to-PWB Reliability: Estimating Solder-Joint Reliability and the Impact of Lead-Free Solders Part 14: Environmental Issues Chapter 60: Process Waste Minimization and Treatment Part 15: Flexible Circuits Chapter 61: Flexible Circuit Applications and Materials Chapter 62: Design of Flexible Circuits Chapter 63: Manufacturing of Flexible Circuits Chapter 64: Termination of Flexible Circuits Chapter 65: Multilayer Flex and Rigid/Flex Chapter 66: Special Constructions of Flexible Circuits Chapter 67: Quality Assurance of Flexible Circuits Appendix Glossary Index
| Reihe/Serie | McGraw-Hill HANDBOOKS |
|---|---|
| Zusatzinfo | 500 Illustrations, unspecified |
| Sprache | englisch |
| Maße | 196 x 241 mm |
| Gewicht | 2626 g |
| Themenwelt | Technik ► Elektrotechnik / Energietechnik |
| ISBN-10 | 0-07-146734-3 / 0071467343 |
| ISBN-13 | 978-0-07-146734-6 / 9780071467346 |
| Zustand | Neuware |
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