Foundations of MEMS

(NOTE: All chapters start with a Preview and conclude with Problems and References.)

 

Chapter 1: Introduction 

1.0. Preview

1.1. The History of MEMS Development  

1.2. The Intrinsic Characteristics of MEMS

1.3. Devices: Sensors and Actuators

 

Chapter 2: Introduction to Microfabrication

2.0. Preview

2.1. Overview of Microfabrication

2.2. The Microelectronics Fabrication Process

2.3. Silicon-based MEMS Process

2.4. New Materials and Fabrication Processes

2.5. Points of Consideration for Processing

 

Chapter 3: Review of Essential Electrical and Mechanical Concepts 

3.0. Preview 

3.1. Conductivity of Semiconductors

3.2. Crystal Planes and Orientations 

3.3. Stress and Strain   

3.4. Flexural Beam Bending Analysis Under Simple Loading Conditions   

3.5. Torsional Deflections  

3.6. Intrinsic Stress   

3.7. Resonant Frequency and Quality Factor   

3.8. Active Tuning of Spring Constant and Resonant Frequency

3.9. A List of Suggested Courses and Books

 

Chapter 4: Electrostatic Sensing and Actuation

4.0. Preview

4.1. Introduction to Electrostatic Sensors and Actuators

4.2. Parallel-Plate Capacitors

4.3. Applications of Parallel-Plate Capacitors   

4.4. Interdigitated Finger Capacitors   

4.5. Applications of Comb-Drive Devices  

 

Chapter 5: Thermal Sensing and Actuation

5.0. Preview

5.1. Introduction 

5.2. Sensors and Actuators Based on Thermal Expansion

5.3. Thermal Couples  

5.4. Thermal Resistors

5.5. Applications 

 

Chapter 6:  Piezoresistive Sensors  

6.0. Preview

6.1. Origin and Expression of Piezoresistivity  

6.2. Piezoresistive Sensor Materials

6.3. Stress Analysis of Mechanical Elements 

6.4. Applications of Piezoresistive Sensors  

 

Chapter 7: Piezoelectric Sensing and Actuation

7.0. Preview

7.1. Introduction 

7.2. Properties of Piezoelectric Materials

7.3. Applications 

 

Chapter 8: Magnetic Actuation

8.0. Preview

8.1. Essential Concepts and Principles   

8.2 Fabrication of Micromagnetic Components   

8.3. Case Studies of MEMS Magnetic Actuators

 

Chapter 9: Summary of Sensing and Actuation

9.0. Preview

9.1. Comparison of Major Sensing and Actuation Methods  

9.2. Tunneling Sensing  

9.3. Optical Sensing  

9.4. Field Effect Transistors  

9.5. Radio Frequency Resonance Sensing  

 

Chapter 10: Bulk Micromachining and Silicon Anisotropic Etching  

10.0. Preview

10.1. Introduction 

10.2. Anisotropic Wet Etching  

10.3. Dry Etching of Silicon - Plasma Etching  

10.4. Deep Reactive Ion Etching (DRIE)   

10.5. Isotropic Wet Etching  

10.6. Gas-Phase Etchants 

10.7. Native Oxide    

10.8. Wafer bonding  

10.9. Case Studies  

 

Chapter 11: Surface Micromachining    

11.0. Preview

11.1. Basic Surface Micromachining Processes

11.2. Structural and Sacrificial Materials

11.3. Acceleration of Sacrificial Etch  

11.4. Stiction and AntiStiction Methods  

11.5. Assembly of 3D MEMS

11.6. Foundry Process  

 

Chapter 12: Polymer MEMS

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12.1. Introduction 

12.2. Polymers in MEMS  

12.3. Representative Applications 

 

Chapter 13: Microfluidics Applications 

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13.1. Motivation for Microfluidics

13.2. Essential Biology Concepts 

13.3. Basic Fluid Mechanics Concepts 

13.4. Design and Fabrication of Selective Components   

 

Chapter 14: Instruments for Scanning Probe Microscopy   

14.0. Preview

14.1. Introduction 

14.2. General Fabrication Methods for Tips 

14.3. Cantilevers with Integrated Tips   

14.4. SPM probes with Sensors and Actuators

 

Chapter 15: Optical MEMS

15.0. Preview

15.1. Passive MEMS Optical Components   

15.2. Actuators for Active Optical MEMS

 

Chapter 16.  MEMS Technology Management   

16.0. Preview

16.1. R&D Strategies