Direct Copper Interconnection for Advanced Semiconductor Technology
CRC Press (Verlag)
978-1-032-52823-6 (ISBN)
This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book.
The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.
Dr. Dongkai Shangguan, IEEE Fellow & IMAPS Fellow, is President of Thermal Engineering Associates, Inc., a provider of analog ASIC chips for thermal testing. He is also a Strategic Advisor to innovative companies in the global semiconductor and electronics industry. Previously, he served as Corporate Vice President for Technology & Engineering at Flex (formerly Flextronics), a global player for electronics design and manufacturing, and as Chief Marketing Officer at STATS ChipPAC (currently JCET), a leading provider of semiconductor assembly and test services. Early in his career, he held various technical and management responsibilities at Ford and Visteon on automotive electronics. Dr. Shangguan has published several books and authored/co-authored over 200 technical papers, and has been issued 32 U.S. patents. He is an IEEE EPS Distinguished Lecturer, and has given numerous keynotes, seminars and lectures globally. Dr. Shangguan has served on the iNEMI Board of Directors, the IEEE EPS Board of Governors, and the IPC Board of Directors. He has received a number of recognitions for his contributions to the industry, including the Electronics Manufacturing Technology Award and the Outstanding Sustained Technical Contribution Award from IEEE EPS, the William D. Ashman Achievement Award from IMAPS, the President’s Award from IPC, and the Total Excellence in Electronics Manufacturing Award from the Society of Manufacturing Engineers. Dr. Shangguan received his B.Sc. degree in Mechanical Engineering from Tsinghua University, China, MBA degree from San Jose State University, and Ph.D. degree in Materials from the University of Oxford, U.K. He conducted post-doctoral teaching and research at the University of Cambridge and The University of Alabama, and has served as a guest professor at several universities. Dr. Shangguan is based in San Jose, California, and travels globally in service of the industry.
Chapter 1: Advanced Packaging Landscape for Heterogeneous Integration Chapter 2: Direct Copper Interconnection for Die/Wafer Bonding: Overview Chapter 3: Hybrid Bonding Process Technology Chapter 4: Materials for Hybrif Bonding Chapter 5: Copper Electrodeposition for Advanced Packaging and Hybrid Bonding Chapter 6: Planarization for Advanced Packaging and Hybrid Chapter 7: Permanent and Temporary Wafer Bonding Chapter 8: Die-to-Wafer Hybrid Bonding for Direct Copper Intercon Chapter 9: Design for Hybrid Bonding and Chiplets Chapter 10: Thermal Modeling and Simulation for Advanced 3DIC Systems Chapter 11: Characterization, Modeling, and Reliability for Direct Copper Interconnection Chapter 12: Applications of Hybrid Bonding and Chiplets for Heterogeneous Integration
| Erscheinungsdatum | 10.07.2024 |
|---|---|
| Zusatzinfo | 21 Tables, black and white; 378 Line drawings, black and white; 20 Halftones, black and white; 398 Illustrations, black and white |
| Verlagsort | London |
| Sprache | englisch |
| Maße | 156 x 234 mm |
| Gewicht | 1011 g |
| Themenwelt | Technik ► Elektrotechnik / Energietechnik |
| Technik ► Maschinenbau | |
| Technik ► Umwelttechnik / Biotechnologie | |
| ISBN-10 | 1-032-52823-0 / 1032528230 |
| ISBN-13 | 978-1-032-52823-6 / 9781032528236 |
| Zustand | Neuware |
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