Proceedings 47th Electronic Components and Technologies Conference (Ectc), 1997

IEEE Components Packaging & Manufacturing Technology Society, Electronic Components & Technology Conference (Autoren)

Institute of Electrical & Electronics Engineers (Herausgeber)

Buch | Softcover

1300 Seiten

1997
I.E.E.E.Press (Verlag)
978-0-7803-3857-9 (ISBN)

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The papers in this work cover many topics, including not only electronic components, but also developments in all areas of electronic technology. Emerging technologies such as optoelectronic and ballgrid array packaging are reported.

Erscheint lt. Verlag	30.11.1997
Verlagsort	Piscataway NJ
Sprache	englisch
Maße	216 x 279 mm
Themenwelt	Technik ► Elektrotechnik / Energietechnik
ISBN-10	0-7803-3857-X / 078033857X
ISBN-13	978-0-7803-3857-9 / 9780780338579
Zustand	Neuware