PRINT CIRCUIT BOARD MATER HB - Martin Jawitz

PRINT CIRCUIT BOARD MATER HB

(Autor)

Buch | Hardcover
784 Seiten
1997 | 200th ed.
McGraw-Hill Professional (Verlag)
978-0-07-032488-6 (ISBN)
74,80 inkl. MwSt
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Select PCB materials for top performing boards. From weaving glass fiber mats to testing finished boards, this materials database offers close-up look at how to process and fabricate PCBs. It gives you hands-on working knowledge of the electrical, mechanical and physical properties of PCB raw materials.
Select PCB materials for top performing boardsFrom weaving glass fiber mats to testing finished boards, this one-stop materials database offers the first close-up look at how to process and fabricate world-class PCBs. Printed Circuit Board Materials Handbook gives you a complete, hands-on working knowledge of the electrical, mechanical and physical properties of PCB raw materials - plus the expertise to transform them into a high-performance printed circuit card. Packed with over 400 how-to illustrations, this encyclopedia tool gives you the know-how to:

Master the processes for glass fiber reinforcement, polyimide film, PET, PEN, and resinsWork with copper foils, anodes, prepreg and laminates, aramid mats, and drill bits and routers Fabricate rigid and flexible printed wiring boards Apply the latest coating, laminating, etching, and electroplating methodsMaximize techniques for hot air leveling, microsection analysis and electrical testResolve controversial cleaning issues and CFC problems plus conduct troublshooting and failure analysisMuch more

McGraw-Hill authors represent the leading experts in their fields and are dedicated to improving the lives, careers, and interests of readers worldwide

Continuous Glass Fiber Reinforcement for Printed Wiring Board Application.Glass Reinforcement.Films, Polymide.Polyethylene Teraphthalate (PET) and Polyethylene Naphthalate (PEN) for Printed Circuit Application.Punching Grades of Copper Clad Laminates.Resins.Copper Foils.Anodes for Printed Wiring Plating.Prepreg and Laminates.Non-Woven Aramid Reinforcement.Drill Bits and Routers.Fabrication of Rigid Printed Wiring Boards.Fabrication of Flexible and Rigid Flexible Printed Wiring Boards.Photoresist.Etching Inner Layers.Oxide Coatings.Lamination of Rigid Multilayer Boards.Lamination of Flex and Rigid Flex Printed Wiring Boards.Entry and Back-Up Material.Drilling Rigid and Flexible Printed Wiring Boards.Desmear/Etchback Process.Plasma Etchback.Electroless Copper Process.Direct Metalization Process.Electroplating.Additive Copper.Etching Outer Layers.Photoimageable Soldermask.Screenable Solder Mask Coatings.Hot Air Leveling.Microsection Anaysis.Electrical Test.

Erscheint lt. Verlag 16.7.1997
Zusatzinfo 400 Illustrations, unspecified
Sprache englisch
Maße 158 x 231 mm
Gewicht 1384 g
Themenwelt Technik Elektrotechnik / Energietechnik
Technik Maschinenbau
ISBN-10 0-07-032488-3 / 0070324883
ISBN-13 978-0-07-032488-6 / 9780070324886
Zustand Neuware
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