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Engineering Materials: Research and Application Optimization

Buch | Softcover
158 Seiten
2023
Trans Tech Publications Ltd (Verlag)
978-3-0364-0329-8 (ISBN)
124,70 inkl. MwSt
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Special topic volume with invited peer-reviewed papers only
This special edition contains a series of articles on research results in areas of materials for applications in opto- and microelectronics and power electronic devices based on silicon carbide. A part of the edition is devoted to properties investigation of green building materials with the use of some waste materials as replacements for conventional components. The issue will be helpful to many specialists whose activity is related to the electronic industry and green construction.

Preface
Chapter 1: Optoelectronics and Electronics Devices
Electrical Properties of GaN Cap Layer for AlGaN/GaN HEMT
Nanomanipulation of Functionalized Gold Nanoparticles on GaN
Impact of Notch Structures on Transfer Characteristics of AlGaN/GaN HEMTs: A Simulation Study
Comparison of the Electrical Performance of AlN and HfO2 Passivation Layer in AlGaN/GaN HEMT
Microfiber Optics Liquid Refractometer: The Effect of Taper Waist
Temperature Dependence of Electrical Characteristics of ZnO Nanowire Field-Effect Transistors with AZO and Aluminium Source/Drain Contact
Study of Strained-SiGe Channel P-MOSFET Using Silvaco TCAD: Impact of Channel Thickness
Investigation on Absorption and Photocurrent in Silicon Absorber with Varied Pyramid Texture Angles by Ray Tracer
Chapter 2: Research and Optimisation of Power Electronic Devices on Silicon Carbide
Threshold Voltage Adjustment on 4H-SiC MOSFETs Using P-Doped Polysilicon as a Gate Material
Demonstration of SiC Trench Gate MOSFETs with Narrow Cell Pitch Using Source Self-Aligned Process
Assessing, Controlling and Understanding Parameter Variations of SiC Power MOSFETs in Switching Operation
Towards Sic-Based VUV Pin-Photodiodes - Investigations on 4H-SiC Photodiodes with Shallow Implanted Al Emitters
Optimizing PECVD a-SiC:H Films for Neural Interface Passivation
Effect of Termination Region on Unclamped Inductive Switching Failure for 4H-SiC VDMOS
Numerical Analysis of the Schottky Contact Properties on the Forward Conduction of MPS/JBS SiC Diodes
Chapter 3: Green Building Materials and Construction Technology
The Mechanical Properties and Microstructure of Gypsum Board Manufactured from Water Hyacinth and Coconut Fiber
Alkaline Activation of Ferrous Foundry Sand: A Look at the Effect of Activator Concentration, Liquid-Solid Ratio and Curing Temperature
Case Study of Applying 3D Laser Scanning Technology to Spacing Inspection of Rebar Placing Work
Utilization of Plastic Waste and Waste Rubber Tyres to Modify Bitumen Binder in Road Construction
Chemical, Mechanical, and Durability of Composites Developed from Aluminum Slag

Erscheinungsdatum
Reihe/Serie Key Engineering Materials
Zusatzinfo Illustrations, unspecified
Verlagsort Zurich
Sprache englisch
Maße 170 x 240 mm
Gewicht 410 g
Themenwelt Technik Elektrotechnik / Energietechnik
Technik Maschinenbau
ISBN-10 3-0364-0329-9 / 3036403299
ISBN-13 978-3-0364-0329-8 / 9783036403298
Zustand Neuware
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