Thermal Reliability of Power Semiconductor Device in the Renewable Energy System - Xiong Du, Jun Zhang, Gaoxian Li, Yaoyi Yu, Cheng Qian

Thermal Reliability of Power Semiconductor Device in the Renewable Energy System

Buch | Softcover
172 Seiten
2023 | 1st ed. 2022
Springer Verlag, Singapore
978-981-19-3134-5 (ISBN)
160,49 inkl. MwSt
This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimental tests are presented to explain existing reliability improvement techniques. This book is a valuable reference for the students and researchers who pay attention to the thermal reliability design of power semiconductor device. 

Xiong Du obtained his B.S., M.S., and Ph. D. degrees from Chongqing University, China in 2000, 2002, and 2005 respectively, all in the Electrical Engineering. He has been with Chongqing University since 2002 and is currently a full professor in the School of Electrical Engineering, Chongqing University. He was a visiting scholar at Rensselaer Polytechnic Institute, Troy, NY from July 2007 to July 2008. His research interests include power electronics system reliability and stability. He is a recipient of the National Excellent Doctoral Dissertation of P.R. China in 2008. Jun Zhang obtained his B.S. degree from Anhui University, China, in 2014 and Ph. D. degree from Chongqing University, China, in 2019, all in the Electrical Engineering. He is currently working as a lecture in the College of Energy and Electrical Engineering, Hohai University, Nanjing, China. His research interests include the reliability of power electronics system.

Introduction.- Thermal fatigue failure mechanism of power devices in renewable energy system.- Thermal model and thermal parameters monitoring.- Thermal analysis of power semiconductor device in renewable energy system.- Multi-time scale lifetime evaluation for the device in the renewable application.- Thermal management design and optimization.- Prospect.

Erscheinungsdatum
Reihe/Serie CPSS Power Electronics Series
Zusatzinfo 94 Illustrations, color; 27 Illustrations, black and white; XVI, 172 p. 121 illus., 94 illus. in color.
Verlagsort Singapore
Sprache englisch
Maße 155 x 235 mm
Themenwelt Technik Elektrotechnik / Energietechnik
Schlagworte failure mechanism • Junction temperature estimation • Lifetime evaluation • thermal management • Thermal parameters monitoring • thermal reliability
ISBN-10 981-19-3134-8 / 9811931348
ISBN-13 978-981-19-3134-5 / 9789811931345
Zustand Neuware
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