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Photon, Beam and Plasma Assisted Processing

Conference Proceedings

I.W. Boyd, E.F. Krimmel (Herausgeber)

Buch | Hardcover
742 Seiten
1989
Elsevier Science Ltd (Verlag)
978-0-444-87301-9 (ISBN)
154,95 inkl. MwSt
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This symposium attracted 82 papers which were presented orally or as posters. Fourteen invited speakers presented state of the art reviews and aspects of future key topics in this increasingly important area of materials science. The high level of scientific presentation during the conference enhanced the aim of the symposium, which was to stimulate discussion amongst materials scientists, chemists, engineers and physicists with a common interest in this field and to disseminate knowledge of progress. A selection of contents: The d doping layer: Electronic properties and device perspectives (F. Koch, A. Zrenner). Future very-large-scale integration technology (M. Hirose). High temperature superconducting ceramics (C.J. Humphreys, D.J. Eaglesham). Theoretical Aspects. A thermal description of the melting of c- and a-silicon under pulsed excimer lasers (S. de Unamuno, E. Fogarassy). Numerical simulation of temperature distributions in layered structures during laser processing (J. Levoska et al.). Deposition. Low temperature plasma enhanced CVD of highly conductive single crystalline and polycrystalline silicon materials (J. Nijs et al.).
Reihe/Serie European Materials Research Aociety Symposia Proceedings S.
Verlagsort Oxford
Sprache englisch
Themenwelt Naturwissenschaften Physik / Astronomie Atom- / Kern- / Molekularphysik
Naturwissenschaften Physik / Astronomie Festkörperphysik
Naturwissenschaften Physik / Astronomie Optik
Technik Elektrotechnik / Energietechnik
Technik Maschinenbau
ISBN-10 0-444-87301-5 / 0444873015
ISBN-13 978-0-444-87301-9 / 9780444873019
Zustand Neuware
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