MicroSystem Based on SiP Technology
Springer Verlag, Singapore
978-981-19-0085-3 (ISBN)
In Part one, the author proposes some new original concepts and thoughts, such as Function Density Law,Si³P and 4D integration. Part one also covers the latest technology of SiP and Advanced Packaging.
Part two covers the latest SiP and Advanced Packaging design and simulation technologies, such as wire bonding, multi-step cavity, chip stacking, 2.5D TSV, 3D TSV, RDL, Fan- In, Fan-Out, Flip Chip, Embedded Passive, Embedded Chip, RF design, Rigid-Flex design, 4D SiP design, Multi-layout project and Team design, as well as SI, PI, thermal simulation, electrical verification and physical verification.
Based on a real design case, part three introduces the design, simulation and implementation methods of different types of SiP, which has a -important reference significance forthe research and development of SiP projects.
This book comprehensively and deeply expounds the latest development, design ideas and design methods of contemporary SiP technology from three aspects: concept and technology, design and simulation, project and case.
Through the detailed introduction of new concepts, design methods, actual projects and cases, this book describes the whole process of SiP products from the beginning of conception to the final realization and makes readers benefit from it.
Mr. Suny Li (Li Yang) is a SiP technical expert with 20 years of working experience. He has participated and guided more than 40 SiP projects in China. In 2021, he published the technical book "Micro System Base on SiP Technology" (PHEI); in 2017, he published the English technical book "SiP system-in-package design and simulation" (WILEY). In 2012, he published the technical book "SiP system level package design and simulation" (PHEI). Suny Li has worked in NSSC (National Space Science Center) of the CAS (Chinese Academy of Sciences) and participated in the ShenZhou series of Manned Space Flight Program and the DSP (Double Star Exploration Program), an ESA and NSSC cooperative space science project. Then, he attended SIEMENS China. In 2007, He joined AcconSys. Suny Li is a senior member of IEEE, a senior member of Chinese institute of Electronics and a senior member of the China Graphics Society. He has obtained more than ten national patents andpublished more than ten papers. Suny graduated from BEIHANG University with a master's degree in Aerospace Science and Technology. At present, Suny is working as a technical expert responsible for SiP and MicroSystem product development, as well as EDA software technical support related to SiP and IC packaging design.
From Moore's law to Function Density Law.- From SiP to Si3P.- SiP Technology and MicroSystem.- From 2D to 4D Integration.- SiP and Advanced Packaging Technology.- SiP Design, Simulation and Verification Platform.- Establishment and Management of Central Library.- SiP Schematic Design Input.- Creation and Setting of Layout.- Management of Design Rules.- Wire Bonding Design in Detail.- Cavity, Chip Stack and TSV design.- RDL and Flip Chip Design.- Layout Route and Plane.- Embedded Passive Design.- RF Circuit Design.- Rigid-Flex Circuits and 4D SiP Design.- Multi-Layout Project and Concurrent DesignSiP Design Flow Based on Advanced Package (HDAP) .- Design Review and Production Data Output.- SiP Simulation and Verification Technology.- Large Capacity Storage SiP Design Case.- SiP Project Planning and Design Case.- 2.5D TSV Technology and Design Case.- Digital T/R Module SiP Design Case.- MEMS Verification SiP Design Case.- Rigid-Flex SiP Design Case.- RF System Integrated SiP Design Case.- PoP RF SiP Design Case.- SiP Production Data Processing Case.
| Erscheinungsdatum | 12.06.2023 |
|---|---|
| Zusatzinfo | 1096 Illustrations, color; 225 Illustrations, black and white; XVIII, 874 p. 1321 illus., 1096 illus. in color. |
| Verlagsort | Singapore |
| Sprache | englisch |
| Maße | 155 x 235 mm |
| Themenwelt | Technik ► Elektrotechnik / Energietechnik |
| Technik ► Maschinenbau | |
| Schlagworte | 2D Integration • 3D integration • 4D Integration • Advanced Package • Fan-in • Fan-out • Function Density Law • Microsystem • Si3P • SIP |
| ISBN-10 | 981-19-0085-X / 981190085X |
| ISBN-13 | 978-981-19-0085-3 / 9789811900853 |
| Zustand | Neuware |
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