Optical Inspection of Microsystems -

Optical Inspection of Microsystems

Wolfgang Osten (Herausgeber)

Buch | Hardcover
503 Seiten
2006
Crc Press Inc (Verlag)
978-0-8493-3682-9 (ISBN)
205,75 inkl. MwSt
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High quality standards are particularly troublesome for MEMS designers, where products used in medicine and safety technology are held to extremely stringent standards. This book offers a review of research into applying optical measurement techniques for microsystems. It presents methods of optical analysis and enumerates their basic components.
Where conventional testing and inspection techniques fail at the micro-scale, optical techniques provide a fast, robust, and relatively inexpensive alternative for investigating the properties and quality of microsystems. Speed, reliability, and cost are critical factors in the continued scale-up of microsystems technology across many industries, and optical techniques are in a unique position to satisfy modern commercial and industrial demands. Optical Inspection of Microsystems is the first comprehensive, up-to-date survey of the most important and widely used full-field optical metrology and inspection technologies. Under the guidance of accomplished researcher Wolfgang Osten, expert contributors from industrial and academic institutions around the world share their expertise and experience with techniques such as image correlation, light scattering, scanning probe microscopy, confocal microscopy, fringe projection, grid and moiré techniques, interference microscopy, laser Doppler vibrometry, holography, speckle metrology, and spectroscopy. They also examine modern approaches to data acquisition and processing. The book emphasizes the evaluation of various properties to increase reliability and promote a consistent approach to optical testing. Numerous practical examples and illustrations reinforce the concepts.

Supplying advanced tools for microsystem manufacturing and characterization, Optical Inspection of Microsystems enables you to reach toward a higher level of quality and reliability in modern micro-scale applications.

Osten, Wolfgang

Image Processing and Computer Vision for MEMS Testing; Markus Hüttel
Introduction
Classification of Tasks
Image Processing and Computer Vision Components
Processing and Analysis of Image Data
Commercial and Noncommercial Image Processing and Computer Vision Software
Image Processing Techniques for the Processing of Fringe Patterns in Optical Metrology
Conclusion
References
Image Correlation Techniques for Microsystems Inspection; Dietmar Vogel and Bernd Michel
Introduction
Deformation Measurement by Digital Image Correlation (DIC) Techniques
Base Equipment for DIC Applications
Applications of DIC Techniques to Microsystems
Conclusions and Outlook
References
Light Scattering Techniques for the Inspection of Microcomponents and Microstructures; Angela Duparré
Introduction
Theoretical Background of Light Scattering
Measurement Equipment
Standardization of Light Scattering Methods
Applications for Microcomponent and Microstructure Inspection
Combination of Light Scattering and Profilometric Techniques
Conclusions and Outlook
References
Characterization and Measurement of Microcomponents with the Atomic Force Microscope (AFM); F. Michael Serry and Joanna Schmit
Introduction
Components of AFM and Principles of AFM Operation
AFM Imaging Modes
AFM Nonimaging Modes
Applications of AFM for Microcomponent Inspection: A Case Study
Atomic Force Profilometer (AFP) — A Combination of AFM and Stylus Profiler
Optical Metrology Complementary to AFM
Conclusions and Outlook
References
Optical Profiling Techniques for MEMS Measurement; Klaus Körner, Aiko Ruprecht, and Tobias Wiesendanger
Introduction
Principles of Confocal Microscopy
Principle of Microscopic Depth-Scanning Fringe Projection (DSFP)
Conclusion
References
Grid and Moiré Methods for Micromeasurements; Anand Asundi, Bing Zhao, and Huimin Xie
Introduction
Grid or Grating Fabrication Methods
Micro-Moiré Interferometer
Moiré Methods Using High-Resolution Microscopy
Microscopic Grid Methods
Conclusions
References
Grating Interferometry for In-Plane Displacement and Strain Measurement of Microcomponents; Leszek Salbut
Introduction
Principle of Grating Interferometry
Waveguide Grating Interferometry
Measurement System
SG Technology
Exemplary Applications of WGI
Conclusions
References
Interference Microscopy Techniques for Microsystem Characterization; Alain Bosseboeuf and Sylvain Petitgrand
Introduction
Interference Microscopes
Modeling of Two-Beam Homodyne Interference Microscopes
Static Measurements by Interference Microscopy
Performance and Issues of Interference Microscopy
Applications of Interferometric Profilometers in the MEMS Field
Dynamic Measurements by Interference Microscopy
Conclusion
Acknowledgments
References
Measuring MEMS in Motion by Laser Doppler Vibrometry; Christian Rembe, Georg Siegmund, Heinrich Steger, and Michael Wörtge
Introduction
Laser Doppler Effect and Its Interferometric Detection
Techniques of Laser Doppler Vibrometry
Full-Field Vibrometry
Measuring on Microscopic Structures
Resolution and Accuracy
Combination with Other Techniques
Examples
Conclusion and Outlook
References
An Interferometric Platform for Static, Quasi-Static, and Dynamic Evaluation of Out-Of-Plane Deformations of MEMS and MOEMS; Christophe Gorecki, Michal Jozwik, and Patrick Delobelle
Introduction
Interferometric Platform Architecture and Principle of Operation
Optomechanical Characterization of Membranes by “Pointwise” Deflection Method
Mechanical Expertise of Scratch Drive Actuators via Interferometric Measurement of Out-of-Plane Microdisplacements
Dynamic Evaluation of Active MOEMS by Interferometry Using Stroboscopic Technique
General Conclusion and Outlook
Acknowledgments
References
Optoelectronic Holography for Testing Electronic Packaging and MEMS; Cosme Furlong
Introduction
Overview of MEMS Fabrication Processes
Optoelectronic Holography
Representative Applications
Summary
Acknowledgments
References
Digital Holography and Its Application in MEMS/MOEMS Inspection; Wolfgang Osten and Pietro Ferraro
Introduction
Theory and Basic Principle of Digital Holography (DH)
Digital Holographic Interferometry
Digital Holographic Microscopy (DHM)
The Application of DH to the Investigation of Microcomponents
Conclusion
References
Speckle Metrology for Microsystem Inspection; Roland Höfling and Petra Aswendt
Introduction
Basics
Applications
Conclusion
References
Spectroscopic Techniques for MEMS Inspection; Ingrid De Wolf
Introduction
Raman Spectroscopy (RS)
Spectroscopic Ellipsometry (SE)
Dual-Beam Spectroscopy (DBS)
X-Ray Photoelectron Spectroscopy (XPS)
High-Resolution Electron Energy Loss Spectroscopy (HREELS)
Auger Electron Spectroscopy (AES)
Brillouin Scattering (BS)
Conclusions
References
Index

Erscheint lt. Verlag 20.7.2006
Co-Autor Angela Duparre, Cosme Furlong, Ingrid De Wolf
Mitarbeit Herausgeber (Serie): Brian J. Thompson
Zusatzinfo 375 equations; 230 Halftones, black and white; 23 Tables, black and white; 479 Illustrations, black and white
Verlagsort Bosa Roca
Sprache englisch
Maße 178 x 254 mm
Gewicht 1089 g
Themenwelt Technik Maschinenbau
Technik Umwelttechnik / Biotechnologie
ISBN-10 0-8493-3682-1 / 0849336821
ISBN-13 978-0-8493-3682-9 / 9780849336829
Zustand Neuware
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