Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology
Springer Verlag, Singapore
978-981-99-1454-8 (ISBN)
This book is mainly aimed at the design and simulation of microwave and millimeter-wave chips based on thin-film integrated passive device technology. On the basis of specific cases, it introduces the whole process from theory, design, simulation, optimization, fabrication to measurement of the balanced filter, microstrip filter, absorptive filter, power divider, and balun.
This book is suitable for the professional technicians who are engaged in the design and engineering application of microwave and millimeter-wave device chips. It can also be used as the textbook of electronic science and technology, electromagnetic field and microwave technology, electronic engineering, radar engineering, integrated circuit, and other related majors in colleges and universities.
Prof. Yongle Wu received his Ph.D. degree in electronic engineering from Beijing University of Posts and Telecommunications (BUPT), China, in 2011. He was a Research Assistant at the City University of Hong Kong (CityU) from April to October 2010. Prof Wu is currently a Professor with the School of Integrated Circuits, BUPT. His research interests include integrated circuits, microwave components, antennas, and wireless systems design. Weimin Wang received the M.S. degree in Electromagnetic Field and Microwave Technology and the Ph. D. degree in Electronic Science and Technology from Beijing University of Posts and Telecommunications (BUPT), in 2004 and 2014 She is currently an Associate Professor in the School of Electronic Engineering, BUPT. Her research interests include electromagnetic field, antennas, microwave circuits and antenna measurement.
Introduction.- Design and Simulation of Balanced Bandpass Filter.- Design and Simulation of Millimeter-Wave Microstrip Bandpass Filter.- Design and Simulation of Input-Absorptive Bandstop Filter.- Design and Simulation of Impedance-Transforming Power Divider.- Design and Simulation of Bandpass Filtering Marchand Balun.
| Erscheinungsdatum | 29.06.2023 |
|---|---|
| Zusatzinfo | 7 Illustrations, color; 686 Illustrations, black and white; XV, 311 p. 693 illus., 7 illus. in color. |
| Verlagsort | Singapore |
| Sprache | englisch |
| Maße | 155 x 235 mm |
| Themenwelt | Technik ► Elektrotechnik / Energietechnik |
| Schlagworte | Design and Simulation of Chips • Integrated circuit • Microwave and Millimeter-Wave • Radio Frequency Devices • Thin-Film Integrated Passive Device Technology |
| ISBN-10 | 981-99-1454-X / 981991454X |
| ISBN-13 | 978-981-99-1454-8 / 9789819914548 |
| Zustand | Neuware |
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