Chiplet Design and Heterogeneous Integration Packaging

For Internal Use Only: John H Lau, Ph.D., P.E., IEEE Fellow, ASME Fellow, IMAPS Fellow Unimicron Technology Corporation, John_Lau@unimicron.com   SPECIALIZED PROFESSIONAL COMPETENCIES [1] Design, analysis, materials, process, manufacturing, qualification, reliability, testing, and thermal management of electronic and optoelectronic components and systems. Fan-out/fan-in WLP, MEMS, LED, CIS, TSV, 3D IC integration, heterogeneous integration/SiP and SMT. Leadfree soldering, manufacturing, and solder joint reliability. [2] Manage R&D teams to develop new and useful technologies for semiconductor advanced packaging. [3] Provide recent advances and trends in advanced packaging to upper managements and guidance to young engineers and managers. Over 22 books (all are the first author), 517 peer-reviewed papers (out of which 375 are principal investigator), 40 issued and pending US patents (out of which 25 are principal inventor), and 325 keynotes/lectures.

State-of-the-Art of Advanced Packaging.- Chip Partition and Chip Split.- Multiple System and Heterogeneous Integration with TSV Interposers.- Multiple System and Heterogeneous Integration with TSV-Less Interposers.- Chiplets Lateral (Horizontal) Communications.- Cu-Cu Hybrid Bonding.