Advanced Materials for Printed Flexible Electronics

Colin Tong is a materials expert with considerable professional experience in the past two decades. His research & development activities and industrial practices cover a broad range of different fields with a special focus on materials testing and characterization, component design and processing of advanced composite materials, metallurgy, thermal management of electronic packaging, electromagnetic interference shielding, integrated optical waveguides, functional metamaterials and metadevices, energy materials, as well as flexible and printed electronics. He holds a Ph.D. degree in Materials Science and Engineering, and a Master's as well as a Bachelor's degree in Materials and Mechanical Engineering. Dr. Tong has published five books, over 30 peer-reviewed papers, and he holds 9 patents. He is a senior member of IEEE (Institute of Electrical and Electronics Engineers). He received the Henry Marion Howe Medal from ASM International for his contribution to research and development on advanced aluminum composite materials in 1999.

Chapter1: Fundamentals and design guides for printed flexible electronics.- Chapter2: Process and material characterization in printed flexible electronics.- Chapter3: Conductive materials for printed flexible electronics.- Chapter4: Semiconducting and dielectric materials for printed flexible electronics.- Chapter5: Insulating and encapsulating materials for printed flexible electronics.- Chapter6: Printed flexible thin film transistors.- Chapter7: Printed flexible light-emitting diodes.- Chapter8: Printable solar cells from solution-processible materials.- Chapter9: Printed flexible electrochemical energy storage devices.- Chapter10: Printed flexible sensors and sensing systems.- Chapter11: Printed flexible hybrid electronics.- Chapter12: Perspectives and current trends in printed electronics manufacturing.