Mechanics of Solder Alloy Interconnects

Darrel R. Frear, Steven N. Burchett, Harold S. Morgan, John H. Lau (Autoren)

Buch | Hardcover

418 Seiten

1994 | 1994 ed.
Van Nostrand Reinhold Inc.,U.S. (Verlag)
978-0-442-01505-3 (ISBN)

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The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.

The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.

Foreword; Acknowldgement; Introduction: the mechanics of soldere alloy interconnect; Microstructural influences on the mechanical properties of solder; Interfaces and intermetallics; Constitutivemodels; Prediction of solder joint geometry; Life prediction and accelerated testing; Thermomechanical modeling of solder joints - numerical considerations; Applications - through-hole; Surface mount solder joints under thermal, mechanical, and vibration conditions; Index

Erscheint lt. Verlag	31.1.1994
Zusatzinfo	XIV, 418 p.
Verlagsort	New York
Sprache	englisch
Maße	152 x 229 mm
Themenwelt	Informatik ► Theorie / Studium ► Algorithmen
	Informatik ► Weitere Themen ► Hardware
	Technik ► Maschinenbau
ISBN-10	0-442-01505-4 / 0442015054
ISBN-13	978-0-442-01505-3 / 9780442015053
Zustand	Neuware