Intelligent Manufacturing and Mechatronics -

Intelligent Manufacturing and Mechatronics

Proceedings of SympoSIMM 2020
Buch | Softcover
1332 Seiten
2021 | 1st ed. 2021
Springer Verlag, Singapore
978-981-16-0865-0 (ISBN)
213,99 inkl. MwSt
This book presents the proceedings of SympoSIMM 2020, the 3rd edition of the Symposium on Intelligent Manufacturing and Mechatronics. Focusing on “Strengthening Innovations Towards Industry 4.0”, the book presents studies on the details of Industry 4.0’s current trends. Divided into five parts covering various areas of manufacturing engineering and mechatronics stream, namely, artificial intelligence, instrumentation and controls, intelligent manufacturing, modelling and simulation, and robotics, the book will be a valuable resource for readers wishing to embrace the new era of Industry 4.0.

Diagnosis of Heart Disease Using Machine Learning Methods.- Investigation of Geomorphological features of Kerian River using Satellite Images.- Review on the Potential of a Tidal Energy Harnessing System in Malaysia.- An Experimental Study of Deep Learning Approach for Indoor Positioning System using WI-FI System.- Defect Factor Analysis using Statistical Process Control Analysis: A Case Study in Spices Defected Packaging Production.- Automatic Counting of Palm Oil Tree Using Satellite Aerial Imagery.- Optimal Design of Step – Cone Pulley Problem using the Bees Algorithm.- Adapting Travelling Salesmen Problem for Realtime UAS Path Planning using Genetic Algorithm.- Predicting the Cycle Time at A Production Line Through the Development of the 3-3-1 Multilayer Perceptron Artificial Neural Networks with Formulated Momentum Rate.- Internet of Things Security: Modelling Smart Industrial Thermostat for Threat vectors and Common Vulnerabilities.- Single Channel Magnetic Induction Measurementfor Meningitis Detection.- Reconstruction of Patient-Specific Cerebral Aneurysm Model through Image Segmentation.- Obstacle Avoiding 4-Legged Mobile Robot using 4-Bar Mechanism.- Improving the Infant-Wrap (InfaWrap) Device for Neonates using MyI-Wrap.- Research Objective in Assembly Line Balancing Problem: A Short Review.

Erscheinungsdatum
Reihe/Serie Lecture Notes in Mechanical Engineering
Zusatzinfo 624 Illustrations, color; 195 Illustrations, black and white; XXI, 1332 p. 819 illus., 624 illus. in color. In 2 volumes, not available separately.
Verlagsort Singapore
Sprache englisch
Maße 155 x 235 mm
Themenwelt Technik Elektrotechnik / Energietechnik
Technik Maschinenbau
ISBN-10 981-16-0865-2 / 9811608652
ISBN-13 978-981-16-0865-0 / 9789811608650
Zustand Neuware
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