Fundamentals of Microelectromechanical Systems (MEMS)
Seiten
2021
McGraw-Hill Education (Verlag)
978-1-264-25758-4 (ISBN)
McGraw-Hill Education (Verlag)
978-1-264-25758-4 (ISBN)
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A complete guide to MEMS engineering, fabrication, and applications
This comprehensive engineering guide shows, step by step, how to incorporate cutting-edge microelectromechanical (MEMS) technology to enable internet-of-things (IoT) and artificial intelligence (AI) functionality in your designs. Written by an experienced educator and microelectronics expert, Fundamentals of Microelectromechanical Systems (MEMS) clearly explains the latest technologies and methods. Real-world examples, illustrations, and in-depth questions and problems reinforce key topics throughout. Readers will also take a look at the future of MEMS in the workforce and explore MEMS research and development.
Coverage includes:
Basic microfabrication
Micromachining
Transduction principles
RF and optical MEMS
Mechanics and inertial sensors
Thin film properties and SAW/BAW sensors
Pressure sensors and microphones
Piezoelectric films
Material properties expressed as tensor
Microfluidic systems and BioMEMS
Power MEMS
Electronic noises, interface circuits, and oscillators
A complete guide to MEMS engineering, fabrication, and applications
This comprehensive engineering guide shows, step by step, how to incorporate cutting-edge microelectromechanical (MEMS) technology to enable internet-of-things (IoT) and artificial intelligence (AI) functionality in your designs. Written by an experienced educator and microelectronics expert, Fundamentals of Microelectromechanical Systems (MEMS) clearly explains the latest technologies and methods. Real-world examples, illustrations, and in-depth questions and problems reinforce key topics throughout. Readers will also take a look at the future of MEMS in the workforce and explore MEMS research and development.
Coverage includes:
Basic microfabrication
Micromachining
Transduction principles
RF and optical MEMS
Mechanics and inertial sensors
Thin film properties and SAW/BAW sensors
Pressure sensors and microphones
Piezoelectric films
Material properties expressed as tensor
Microfluidic systems and BioMEMS
Power MEMS
Electronic noises, interface circuits, and oscillators
Erscheinungsdatum | 04.05.2021 |
---|---|
Zusatzinfo | 500 Illustrations |
Verlagsort | OH |
Sprache | englisch |
Maße | 196 x 244 mm |
Gewicht | 925 g |
Themenwelt | Technik ► Elektrotechnik / Energietechnik |
Technik ► Nachrichtentechnik | |
ISBN-10 | 1-264-25758-9 / 1264257589 |
ISBN-13 | 978-1-264-25758-4 / 9781264257584 |
Zustand | Neuware |
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