Millimeter-Wave Integrated Circuits (eBook)

Preface 6
Contents 9
About the Authors 13
1 Device Scaling: Going from “Micro-” to “Nano-” Electronics 14
1.1 A Modern Communication System: The Driving Force of Millimeter-Wave Nanoelectronics 18
1.2 Research into Ever-Faster Device Technologies 19
1.3 Physics of Miniature (Deep-Submicron) Active Devices 20
1.3.1 Deep-Submicron Metal-Oxide Semiconductor Field-Effect Transistors 21
1.3.2 Deep-Submicron High-Electron-Mobility Transistors 36
1.3.3 Metal-Oxide-Semiconductor High-Electron Mobility Transistors 40
1.3.4 Deep-Submicron Bipolar Transistors 40
1.4 Contribution of This Book to the Body of Knowledge 47
1.5 Content Overview 48
References 49
2 Electronic Design Automation for Millimeter-Wave Research and Design 54
2.1 Semiconductor Industry Implementation Flow 56
2.2 Commercial and Open-Source Electronic Design Automation Tools 60
2.2.1 Commercial Tools 61
2.2.2 Open-Source Approach and Tools 63
2.3 Schematic Capture 65
2.4 Component Modeling 67
2.5 Simulation 69
2.6 Layout Design and Extraction 71
2.6.1 Floor Planning, Placement and Routing 72
2.6.2 Layout Checks 75
2.6.3 Post-Layout Simulation 76
2.6.4 Bonding Pads 76
2.6.5 Extraction for Fabrication 78
2.6.6 Overview of the Fabrication Process and Steps 78
2.7 System-Level Simulation and Automation 81
2.8 Electromagnetic and 3D Simulations 82
2.9 Role of Technology Computer-Aided Design 83
2.10 Concluding Remarks 84
References 84
3 Millimeter-Wave Substrates and System-Level Approach in Millimeter-Wave Research and Design 87
3.1 Discrete Substrates 88
3.1.1 Important Substrate Properties 90
3.1.2 Classification of Substrates 92
3.2 System-on-Chip Approach to Packaging 95
3.2.1 Millimeter-Wave Packages and Bonding 96
3.2.2 Circuit Reusability in System-on-Chip 100
3.2.3 On-Chip Sensors 101
3.2.4 Antennas on Chip 101
3.3 Multi-Chip Modules and 3D Integrated Circuits 103
3.3.1 Multi-Chip Packaging Options 104
3.3.2 Advantages and Challenges of the Multi-Chip Packaging Approach 105
3.3.3 3D Packaging 105
3.3.4 Interconnects 107
3.4 System-on-Package 110
3.4.1 Advantages and Challenges of the System-on-Package Approach 111
3.4.2 Popular System-on-Package Technologies 112
3.4.3 Interconnects and Transitions 113
3.4.4 Antennas on Package 115
3.4.5 System-on-Package Topology Decision 115
3.5 Economics of Packaging 116
3.6 Testing of System-on-Chip, Multi-Chip Modules and System-on-Package 117
3.7 Steps in Making a Package Choice and Successful Packaging Execution 118
3.8 Concluding Remarks 120
References 120
4 Methodologies for Millimeter-Wave Circuit Design 124
4.1 Low-Frequency and DC Design 125
4.1.1 Biasing 125
4.1.2 Low-Frequency Amplifier Design 128
4.2 Millimeter-Wave Power Amplifiers 131
4.2.1 Main Characteristics of Power Amplifiers 131
4.2.2 Classification of Power Amplifiers 134
4.2.3 Millimeter-Wave Switch-Mode Power Amplifiers 135
4.3 Millimeter-Wave Low-Noise Amplifiers 144
4.3.1 Main Characteristics of Low-Noise Amplifiers 145
4.3.2 Narrowband Low-Noise Amplifiers 147
4.3.3 Broadband Low-Noise Amplifiers 153
4.4 Impedance Matching 157
4.5 Millimeter-Wave Oscillators 159
4.5.1 Local Oscillators 160
4.5.2 Voltage-Controlled Oscillators 164
4.6 Mixers 165
4.7 Filters 167
4.7.1 Passive Band-Pass Filters 169
4.7.2 Active Band-Pass Filters 170
4.8 Concluding Remarks 171
References 173
5 Methodologies for Millimeter-Wave Circuit Design in Extreme Environments 176
5.1 Types of Extreme Environments and Their Practical Examples 178
5.2 Extreme Temperature Electronics 183
5.2.1 Temperature Effects on Semiconductors 183
5.2.2 Operating in Moderately and Very Hot Environments 188
5.2.3 Operating in Cold Environments 190
5.2.4 Temperature Effects on Passives 191
5.3 Radiation Effects on Electronics 192
5.3.1 Sources of Radiation 193
5.3.2 Types of Radiation Effects on Electronic Components 194
5.3.3 Radiation Effects on Semiconductors 195
5.3.4 Radiation Hardening of Electronic Circuits 197
5.4 SiGe Technology—Towards an Omni-Suitable Technology 198
5.5 Humidity and Moisture: Corrosive Environments 200
5.6 Electronic Circuits Operating in Extreme Vibration Environments 200
5.7 Packaging for Extreme Environments 201
5.8 Simulation for Extreme Environment Circuit Operation 203
5.9 Concluding Remarks 204
References 205
6 Further Device Scaling: From Nanoelectronics to Future Technologies 208
6.1 FinFETs 209
6.2 Cooling of Nanoelectronic Circuits for Better Frequency Performance 211
6.3 Superconductivity 212
6.4 Quantum Computing 214
6.5 Alternatives to Traditional Semiconductor Technologies 217
6.5.1 Graphene-Based Electronics 217
6.5.2 Diamond-Based Electronics 220
6.5.3 Carbon Nanotubes 221
6.5.4 Optoelectronics 223
6.5.5 Spintronics 226
6.6 Concluding Remarks 228
References 228
7 Getting Ready for Terahertz Electronics 232
7.1 Terahertz Communication Electronics 234
7.2 Terahertz Radar Sensing 240
7.3 Terahertz Imaging (Spectrometry and Radar) 243
7.4 Traditional Terahertz Electronics Implementations and Passive Sensing 245
7.4.1 Electronic Systems Based on Schottky Diodes 245
7.4.2 Optical Terahertz Emitters 246
7.4.3 Passive Solid-State Detection 246
7.5 Solid-State Devices Capable of Amplifying at Terahertz Frequencies 248
7.5.1 SiGe BiCMOS Technology 249
7.5.2 InP Technologies 249
7.5.3 GaAs and GaN Technologies 250
7.5.4 CMOS Technology 252
7.6 Challenges in Wide Adoption of Terahertz Electronics 253
7.7 Chapter Concluding Remarks 255
7.8 Book Concluding Remarks 255
References 256