![Für diesen Artikel ist leider kein Bild verfügbar.](/img/platzhalter480px.png)
Handbook of Lead-Free Solder Technology
McGraw Hill Higher Education (Verlag)
978-0-07-138337-0 (ISBN)
- Titel wird leider nicht erscheinen
- Artikel merken
The toxic effects of lead are well known. The presence of dangerous lead levels in consumer electronic products like laptops and desktop computers, cell phones, palm pilots and cameras has been less publicized. Lead in electronics is now banned in Europe and Japan and market forces have created a defacto ban in North America. A ban on lead has severe consequences for microelectronics: lead replacements will have higher melting points and the higher temperatures required for packaging and manufacturing processes will affect printed circuit board finishes and materials, fluxes and the entire soldering process. Written by a global team of experts from key companies around the world (IBM, Cookson, Nokia), this book provides a tutorial and reference for electronics manufacturers currently beginning or already undergoing the lead-free conversion process, dealing with each effect the lead ban will have on microelectronics packaging and manufacturing. Spearheaded by IBM's industry-leading Corporate Lead Reduction operation, the book presents a complete technology programme for dealing with the necessitated switch to lead-free solders. It deals with both technology and market issues.
Part 1 Background and driving forces: health-related factors; lead consumption / disposition (landfills, incineration); regional drivers; marketing inputs / advantages. Part 2 Lead-free alternatives and manufacturing considerations: lead-free finishes for board and components; solder-based interconnections; non-solder alternative interconnections; alternative solder alloy studies; assembly considerations - process / equipment; use of inert atmospheres; lead-free / reduced manufacturing experiences; reliability. Part 3 Lead-free solder technologies: lead-tin systems / features; non-lead based solder systems; wetting / spreading; finishes - board and components; intermetallic formation; dispersion strengthened systems; assembly; mechanical properties. Part 4 Other considerations: procurement / supply chain; economic considerations of lead-free implementation.
Erscheint lt. Verlag | 1.1.2003 |
---|---|
Reihe/Serie | Engineering Handbook |
Zusatzinfo | 500 illustrations |
Verlagsort | London |
Sprache | englisch |
Maße | 189 x 235 mm |
Themenwelt | Technik ► Elektrotechnik / Energietechnik |
ISBN-10 | 0-07-138337-9 / 0071383379 |
ISBN-13 | 978-0-07-138337-0 / 9780071383370 |
Zustand | Neuware |
Haben Sie eine Frage zum Produkt? |
aus dem Bereich