Systems-Level Packaging for Millimeter-Wave Transceivers
Springer International Publishing (Verlag)
978-3-030-14689-4 (ISBN)
Saurabh Sinha is a Full Professor of Microelectronics and Executive Dean of the Faculty of Engineering and the Built Environment at the University of Johannesburg, South Africa. In addition, he is the Managing Editor of the South African Institute of Electrical Engineers (SAIEE) Africa Research Journal.
Introduction and Research Impact.- Millimeter-Wave Research Challenges.-Behavior of Active and Passive Devices at Millimeter-Wave Frequencies.- Integrated Substrates: Millimeter-Wave Transistor Technologies.- Discrete Substrates: Package Foundation.- Traditional Approach: System-on-Chip.- Multi-Chip Modules and Multi-Chip Packaging.- State-of-the-Art Approach: System-on-Package.- Evaluation of Research Questions, Remaining Research Gaps and Future Directions.
Erscheinungsdatum | 06.04.2019 |
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Reihe/Serie | Smart Sensors, Measurement and Instrumentation |
Zusatzinfo | XV, 277 p. |
Verlagsort | Cham |
Sprache | englisch |
Maße | 155 x 235 mm |
Gewicht | 601 g |
Themenwelt | Technik ► Elektrotechnik / Energietechnik |
Technik ► Nachrichtentechnik | |
Schlagworte | Integrated Circuits • internet of things • Microwave Microelectronics • Millimeter-wave Devices • Millimeter-wave Electronics • Millimeter-wave Transmission • Packaging system decision • System-on-Chip • System-on-package • Transceivers |
ISBN-10 | 3-030-14689-8 / 3030146898 |
ISBN-13 | 978-3-030-14689-4 / 9783030146894 |
Zustand | Neuware |
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