Thermanl Conductivity 33/Thermal Expansion 21

Presents thermophysical property and heat transfer research involving new thermal and thermo-mechanical measurements and models for a wide range of chemical compounds, engineered and building materials, ionic liquids, insulation, and electronics. The twenty-two papers included in the book are selected, refereed, and edited versions of presentations made at the 33rd International Thermal Conductivity Conference (ITCC) and the 21st International Thermal Expansion Symposium (ITCE). Some of the highlights of the book include: - Innovative approaches and apparatus for measuring thermophysical properties and heat transfer. - Selected papers are organized into four robust chapters on measurement methods, materials properties, analysis and modeling, and advanced materials and applications. - Examines thermophysical properties and heat transfer in metals, engineered and building materials, electronics, liquid metals and more. - All articles have been edited and reviewed.