Flexible Glass (eBook)

Sean M. Garner received a B.Eng. degree in Engineering Physics (Applied Laser and Optics) from Stevens Institute of Technology in 1993 and a Ph.D. in Electrical Engineering (Electrophysics) from the University of Southern California in 1998. Sean joined Corning Incorporated in 1998 working in the area of materials processing and device prototyping, and today he continues this work at the company's Science and Technology Center as a Senior Research Associate. Sean has co-authored over 190 journal articles and conference presentations, currently has 24 granted patents, and has received numerous professional awards such as from S3IP, IEEE, SID, FlexTech, AIMCAL, as well as from Corning. Sean has been actively involved in the research and development of Corning® Willow® Glass and receives frequent international invitations for invited talks and guest lectures.

Preface xi

Part I: Flexible Glass & Flexible Glass Reliability

1 Introduction to Flexible Glass Substrates 3
Sean M. Garner, Xinghua Li, and Ming-Huang Huang

1.1 Overview of Flexible Glass 3

1.2 Flexible Glass Properties 5

1.3 Flexible Glass Web for R2R Processing 21

1.4 Flexible Glass Laser Cutting 22

1.5 Summary 23

2 The Mechanical Reliability of Thin, Flexible Glass 35
G. Scott Glaesemann

2.1 Introduction 35

2.2 The Mechanical Reliability of Glass 36

2.3 Applied Stress 49

2.4 The Strength of Thin Glass Sheets 52

3 Low Modulus, Damage Resistant Glass for Ultra-Thin Applications 63
Timothy M. Gross and Randall E. Youngman

3.1 Introduction 64

3.2 Young's Modulus and Basic Fracture Mechanics 64

3.3 Vickers Indentation Cracking Resistance of Calcium Aluminoborosilicate Glasses 77

Part II: Flexible Glass Device Fabrication

4 Roll-to-Roll Processing of Flexible Glass 87
James C. Switzer III and Mark D. Poliks

4.1 Introduction 87

4.2 Roll-to-Roll Manufacturing Process Equipment 90

4.3 R2R Deposition and Patterning of ITO on Thin Flexible Glass and Plastic films 104

4.4 Conclusions 121

4.5 Future 122

5 Thin-Film Deposition on Flexible Glass by Plasma Processes 129
Manuela Junghähnel and John Fahlteich

5.1 Introduction 130

5.2 Substrate Requirements for Vacuum Processes 130

5.3 Types of Vacuum Processes 133

5.4 Large Area Coatings onto Flexible Glass 159

5.5 Thermal Pre- and Post-Treatment for Flexible Glass 167

5.6 Future Trends in Vacuum Processing on Flexible Glass 173

6 Printed Electronics Solution-Based Processes with Flexible Glass 181
Jukka Hast, Elina Jansson, Riikka Suhonen, Liisa Hakola, Markus Tuomikoski, Marja Vilkman, Kari Rönkä and Harri Kopola

6.1 Introduction 181

6.2 Printing Processes 183

6.3 Summary of Different Printing Processes 198

6.4 Example - Printed OPV Cell on Ultra-Thin Flexible Glass 198

6.5 Future 203

Part III: Flexible Glass Device Applications

7 Flexible Glass in Thin Film Photovoltaics 213
Matthew O. Reese and Teresa M. Barnes

7.1 Introduction 213

7.2 General Substrate Requirements for Photovoltaic 215

7.3 Requirements for CdTe Superstrates 233

7.4 Standard CdTe device stack and processing 235

7.5 Flexible CdTe Device performance 236

7.6 Flex and Bend Testing of CdTe 238

8 Ultra-Thin Glass for Displays, Lighting and Touch Sensors 247
Steffen Hoehla and Norbert Fruehauf

8.1 Introduction and Overview 247

8.2 Ultra Thin Glass Substrates for Flexible Displays 254

8.3 Thin Film Device Processing on Ultra Thin Glass 265

8.4 Thin Glass Displays 282

9 Guided-Wave Photonics in Flexible Glass 291
Sheng Huang, Mingshan Li and Kevin P. Chen

9.1 Flexible Guided-Wave Photonics 292

9.2 Flexible Polymer Passive Waveguide Photonics 292

9.3 Flexible Polymer Active Waveguide Photonics 299

9.4 Flexible Polymer Waveguides for Electro-Optic Applications 301

9.5 Flexible Glass Optical Substrates 303

9.6 Ultrafast-Laser Fabrication of Embedded Waveguides 305

9.7 Embedded Waveguides in Flexible Glass 307

9.8 Prospective of Thermal Poling in Flexible Glass Waveguides 321

10 Flexible Glass for Microelectronics Integration 331
Murat Okandan, Jose Luis Cruz-Campa, Gregory N. Nielson

10.1 Introduction 332

10.2 Integration Technology Description: Why Flexible Glass for Electronics/Sensor Integration (3 Dimensional Integrated Circuits - 3DIC) 332

10.3 Example of Microelectronics/Sensor Integration 333

10.4 Fabrication Techniques 336

10.5 Future Direction 345