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Scaling And Integration Of High-speed Electronics And Optomechanical Systems
Seiten
2017
World Scientific Publishing Co Pte Ltd (Verlag)
978-981-322-539-8 (ISBN)
World Scientific Publishing Co Pte Ltd (Verlag)
978-981-322-539-8 (ISBN)
Coined as the third revolution in electronics is under way; Manufacturing is going digital, driven by computing revolution, powered by MOS technology, in particular, by the CMOS technology and its development.In this book, the scaling challenges for CMOS: SiGe BiCMOS, THz and niche technology are covered; the first article looks at scaling challenges for CMOS from an industrial point of view (review of the latest innovations); the second article focuses on SiGe BiCMOS technologies (deals with high-speed up to the THz-region), and the third article reports on circuits associated with source/drain integration in 14 nm and beyond FinFET technology nodes. Followed by the last two articles on niche applications for emerging technologies: one deals with carbon nanotube network and plasmonics for the THz region carbon, while the other reviews the recent developments in integrated on-chip nano-optomechanical systems.
Erscheinungsdatum | 22.06.2017 |
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Reihe/Serie | Selected Topics in Electronics and Systems ; 59 |
Verlagsort | Singapore |
Sprache | englisch |
Themenwelt | Technik ► Elektrotechnik / Energietechnik |
ISBN-10 | 981-322-539-4 / 9813225394 |
ISBN-13 | 978-981-322-539-8 / 9789813225398 |
Zustand | Neuware |
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