RF and Microwave Microelectronics Packaging II (eBook)

Ken Kuang is President of Torrey Hills Technologies, LLC, a leader in the supply of quality microelectronics packaging components. From 2004-2013, Kuang led Torrey Hills to rank #188 in INC500 Fast Growing Private Companies in America and rank #2 in San Diego Business Journal 100 Fastest Growing Private Companies in San Diego. Kuang was three times the finalist for the Most Admired CEO in San Diego. Rick Sturdivant has been President of Microwave Packaging Technology, Inc. (MPT) since 2003. He regularly presents at conference workshops and other venues, and has been a guest lecturer at Georgia Tech Research Institute. He is a recognized expert in the field of Transmit/Receive (T/R) modules for phased array radar and communication systems.

Dedication 5
Foreword 6
Foreword 7
Contents 9
Chapter 1: Introduction to Radio Frequency and Microwave Microelectronic Packaging 11
1.1 Introduction 11
1.2 Frequency Bands 12
1.3 Distributed Effects 13
1.4 Transmission Lines 15
1.5 Commonly Used Transmission Lines 17
1.6 Dispersion in Transmission Lines 18
1.7 Dielectric and Substrate Materials 19
1.8 Skin Depth 22
1.9 Thermal Conductivity, Electrical Conductivity, and Thermal Expansion 23
1.10 Chapter Conclusions 27
References 27
Chapter 2: Packaging of Transmit/Receive Modules 28
2.1 Introduction to Packaging of Transmit/Receive Modules 28
2.1.1 Active Electronically Scanned Arrays 29
2.1.2 T/R Module Block Diagram 29
2.2 Systems Using T/R Modules 31
2.3 T/R Modules in Communication Systems 31
2.3.1 Cellular Base Stations 31
2.3.2 Wi-Fi Indoor Location Systems Using Phased Arrays 32
2.3.3 60 GHz Wi-Fi 33
2.3.4 Millimeter-Wave Point-to-Point Systems 33
2.4 T/R Modules in Phased Array Radar 35
2.4.1 Brick Array 35
2.4.2 Tile Array 35
2.4.3 Panel Array 36
2.5 Thermal Packaging Challenges 37
2.6 Wafer Level T/R Module Packaging 39
2.7 Conclusions 39
References 40
Chapter 3: 3D Transitions and Connections 42
3.1 Introduction 42
3.2 Vertical Transitions Between Planar Transmission Lines 43
3.2.1 Microstrip or Coplanar Waveguide to Stripline 44
3.2.2 Top Side Microstrip to Bottom Side Microstrip 46
3.2.3 Microstrip to Waveguide Transition 47
3.3 Through Silicon Via 3D Transitions 47
3.4 Vertical Transitions Using Connectors 48
3.5 Vertical Transition Using Flip Chip 50
3.6 Conclusions 50
References 50
Chapter 4: Electromagnetic Shielding for RF and Microwave Packages 52
4.1 Introduction 52
4.2 Electromagnetic Radiation 53
4.2.1 The Source of Radiation 54
4.2.2 How an Antenna Radiates Electric and Magnetic Fields 56
4.2.3 Theoretical View of Radiation 57
4.2.4 Electromagnetic Simulation and Computational Method 58
4.2.4.1 The Finite Element Method 59
4.2.4.2 Method of Moments 59
4.2.4.3 Finite-Difference Time-Domain 60
4.2.4.4 Finite-Differences Frequency-Domain 60
4.3 Shielding Techniques and Methods 61
4.3.1 Metal Caps 61
4.3.2 Plating 62
4.3.3 Spray Coating 63
4.3.4 Sputtering 63
4.4 Shielding Performance of Thin-layer Conformal Shielding 64
4.4.1 Shielding Performance Measurement Methods 65
4.4.2 Test Vehicles 66
4.4.3 Shielding Effectiveness 67
4.4.4 Far-field Shielding Performance Measurements 67
4.4.5 Near-field Shielding Performance Measurements 69
4.5 Summary 70
References 71
Chapter 5: Design of C-Band Interdigital Filter and Compact C-Band Hairpin Bandpass Film Filter on Thin Film Substrate 72
5.1 Introduction 72
5.2 Microstrip Filter 73
5.3 Design of the Interdigital Filter 74
5.3.1 Structure of the Filter 74
5.3.2 The Simulation Analysis 75
5.3.3 The Test Results 77
5.4 Design of the Hairpin Filter 78
5.4.1 Structure of the Filter 78
5.4.2 The Simulation Analysis 78
5.4.3 The Test Results 80
5.5 Conclusion 81
References 82
Chapter 6: Research on High-Reliable Low-Loss HTCC Technology Applied in Millimeter Wave SMT Package 83
6.1 Introduction 83
6.2 Research Work 83
6.2.1 Low-Loss Ceramic 83
6.2.2 Co-fired Tungsten Conductor Pastes 86
6.2.3 SMT Package Prepared by the High-Reliable Low-Loss HTCC Technology 88
6.3 Conclusions 89
References 90
Chapter 7: Chip Size Packaging (CSP) for RF MEMS Devices 91
7.1 Introduction 91
7.2 Challenges for RF MEMS Packaging 92
7.3 Traditional MEMS Packaging Techniques and their Limitations 92
7.4 An Overview of CSP Packaging Technique 93
7.5 Gold Bump FC-CSP Packaging 96
7.5.1 Ultrasonic Gold (Stub) Bumping 96
7.5.2 Dicing 97
7.5.2.1 Conventional Blade Dicing for MEMS Chips 97
7.5.2.2 Stealth Laser Dicing 98
7.5.3 Flip Chip Bonding 98
7.5.4 Film Pasting (Molding) 101
7.6 WL-CSP (Wafer-Level) 102
7.6.1 Wafer Level Packaging Design 102
7.6.2 Via/Hole Drilling 103
7.6.3 RDL Metallization 103
7.6.4 Wafer Bonding 103
7.7 Conclusion 104
References 104
Chapter 8: The Challenge in Packaging and Assembling the Advanced Power Amplifiers 106
8.1 Introduction 106
8.2 Thermal Analysis 107
8.3 Challenges Analysis 110
8.3.1 ?die 110
8.3.2 ?die-mount 112
8.3.3 ?base and ?flange 113
8.3.4 ?flange-case mount 114
8.4 Case Study 114
8.5 New Approaches 116
8.5.1 Package Materials 116
8.5.2 Die-Mounting Material 117
8.6 Conclusions 118
References 119
Chapter 9: High Thermal Conductivity Materials: Aluminum Diamond, Aluminum Silicon Carbide, and Copper Diamond 120
9.1 Materials Used in Microwave Packages and Expectations from Materials, Availability and Properties of These Materials 120
9.2 Role of Aluminum Diamond and AlSiC in Advancing Microwave Technology 122
9.3 Electronic Package Fabrication Process 128
9.4 Core Capabilities 130
9.5 Conclusion 133
References 134
Chapter 10: Advancement in High Thermal Conductive Graphite for Microelectronic Packaging 135
10.1 Introduction 135
10.2 TPG and TPG-Metal Composites 136
10.2.1 Thermal Pyrolytic Graphite (TPG) 136
10.2.2 TPG-Metal Composite 137
10.3 Design, Property, and Reliability 139
10.3.1 Design Principles 139
10.3.2 Thermal Conductivity 142
10.3.3 Thermal Expansion 142
10.3.4 Reliability 143
10.4 Applications 144
10.4.1 TC1050* Heat Spreader 145
10.4.2 TMP-EX Heat Sink 146
10.4.3 TMP-FX Thermal Strap 148
10.5 Summary 150
References 151
Chapter 11: Carbon Nanotubes and Graphene for Microwave/RF Electronics Packaging 152
11.1 Introduction 152
11.2 Carbon Nanotubes and Graphene Structure and Properties 153
11.2.1 Structure of Carbon Nanotubes and Graphene 153
11.2.2 Mechanical Properties 155
11.2.3 Electrical Properties 156
11.2.4 Thermal Properties 157
11.3 Applications 158
11.3.1 Carbon Nanotube for Thermal Interface Materials (TIMs) 158
11.3.2 Carbon Nanotubes/Nanofibers (CNTs/CNFs) for Interconnects 160
11.3.3 Graphene for Interconnects 161
11.3.4 Graphene for Heat Spreading Layers 162
11.3.5 Graphene for Other Applications of IC Packaging 163
11.4 Challenges 164
11.5 Summary 165
References 165
Erratum to 173
Index 174