Optical, Acoustic, Magnetic, and Mechanical Sensor Technologies -

Optical, Acoustic, Magnetic, and Mechanical Sensor Technologies

Krzysztof Iniewski (Herausgeber)

Buch | Softcover
358 Seiten
2017
CRC Press (Verlag)
978-1-138-07481-1 (ISBN)
95,95 inkl. MwSt
Light on physics and math, with a heavy focus on practical applications, Optical, Acoustic, Magnetic, and Mechanical Sensor Technologies discusses the developments necessary to realize the growth of truly integrated sensors for use in physical, biological, optical, and chemical sensing, as well as future micro- and nanotechnologies.

Used to pick up sound, movement, and optical or magnetic signals, portable and lightweight sensors are perpetually in demand in consumer electronics, biomedical engineering, military applications, and a wide range of other sectors. However, despite extensive existing developments in computing and communications for integrated microsystems, we are only just now seeing real transformational changes in sensors, which are critical to conducting so many advanced, integrated tasks.

This book is designed in two sections—Optical and Acoustic Sensors and Magnetic and Mechanical Sensors—that address the latest developments in sensors.

The first part covers:






Optical and acoustic sensors, particularly those based on polymer optical fibers
Potential of integrated optical biosensors and silicon photonics
Luminescent thermometry and solar cell analyses
Description of research from United States Army Research Laboratory on sensing applications using photoacoustic spectroscopy
Advances in the design of underwater acoustic modems

The second discusses:






Magnetic and mechanical sensors, starting with coverage of magnetic field scanning
Some contributors’ personal accomplishments in combining MEMS and CMOS technologies for artificial microsystems used to sense airflow, temperature, and humidity
MEMS-based micro hot-plate devices
Vibration energy harvesting with piezoelectric MEMS
Self-powered wireless sensing

As sensors inevitably become omnipresent elements in most aspects of everyday life, this book assesses their massive potential in the development of interfacing applications for various areas of product design and sciences—including electronics, photonics, mechanics, chemistry, and biology, to name just a few.

Krzysztof (Kris) Iniewski manages R&D at Redlen Technologies Inc., a start-up company in Vancouver, British Columbia, Canada. Redlen’s revolutionary production process for advanced semiconductor materials is enabling a new generation of more accurate, all-digital, radiation-based imaging solutions. Dr. Iniewski is also president of CMOS Emerging Technologies, which organizes high-tech events covering communications, microsystems, optoelectronics, and sensors. Dr. Iniewski has held numerous faculty and management positions at the University of Toronto, the University of Alberta, SFU, and PMC-Sierra, Inc. He holds 18 international patents, has published more than 100 research papers in international journals and conferences, and has written and edited several books. He is frequently invited as a speaker and has consulted for several organizations around the world.

PART 1: Optical and Acoustic Sensors

Optical Fiber Sensors. Sensors Based on Polymer Optical Fibers: Microstructured and Solid Fibers. Label-Free Biosensors for Biomedical Applications: The Potential of Integrated Optical Biosensors and Silicon Photonics. Luminescent Thermometry for Sensing Rapid Thermal Profiles in Fires and Explosions. Solar Cell Analyses with Ultraviolet–Visible–Near-Infrared Spectroscopy and I–V Measurements. Sensing Applications Using Photoacoustic Spectroscopy. Design of a Low-Cost Underwater Acoustic Modem.

PART 2: Magnetic and Mechanical Sensors

Accurate Scanning of Magnetic Fields. Artificial Microsystems for Sensing Airflow, Temperature, and Humidity by Combining MEMS and CMOS Technologies. Microelectromechanical System-Based Micro Hot-Plate Devices. Vibration Energy Harvesting with Piezoelectric Microelectromechanical Systems. Self-Powered Wireless Sensing in Ground Transport Applications.

Erscheinungsdatum
Reihe/Serie Devices, Circuits, and Systems
Zusatzinfo 22 Tables, black and white; 169 Illustrations, black and white
Verlagsort London
Sprache englisch
Maße 156 x 234 mm
Gewicht 453 g
Themenwelt Naturwissenschaften Physik / Astronomie Optik
Technik Elektrotechnik / Energietechnik
Technik Maschinenbau
Technik Umwelttechnik / Biotechnologie
ISBN-10 1-138-07481-0 / 1138074810
ISBN-13 978-1-138-07481-1 / 9781138074811
Zustand Neuware
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