Managing Heat Generation in Electronic Devices
Blackwell Verlag GmbH
978-3-527-41348-5 (ISBN)
Patrick Schelling is an Associate Professor of Physics at the University of Central Florida. After having obtained his B.S. and Ph.D. degrees at the University of Minnesota, he spent four years at Argonne National Laboratory. Patrick Schelling specializes in the application of computational and theoretical approaches to problems in physics, materials science, and planetary science. He is the author of over 40 scientific publications mostly related to the transport of matter and heat in solids. Sanjiv Sinha is an Assistant Professor in the Department of Mechanical Science and Engineering at the University of Illinois at Urbana-Champaign. He received a B.Tech degree in Mechanical Engineering from the Indian Institute of Technology, Delhi in 1999 and the M.S. (2001) and Ph.D. (2005) degrees in Mechanical Engineering from Stanford University. After graduation, he worked at Intel for 18 months on hot electrons and phonons in advanced transistors, and did post-doctoral research on silicon nanowire thermoelectrics at the University of California, Berkeley. Sanjiv Sinha received the NSF CAREER award in 2010 and was recently selected for the DARPA-Young Faculty Award. His current interests are in phonon transport phenomena, semiconductor device physics and thermoelectrics. His group employs theoretical tools and ultrafast laser experiments to probe fundamental transport and to devise ways to engineer transport for specific applications.
Introduction
1 Overview of heat management in electronics
Part I. Fundamentals of Thermal Transport
2 Solid-state heat conduction
3 Phonon Mean Free Paths
4 Interfacial thermal transport
5 Transport in confined geometries
6 Non-equilibrium heat transport in electronics
7 Computational approaches
Part II. Applied Thermal Management
8 Hierarchy of Thermal Management
9 Device Level Considerations
10 Chip Level Management
11 Systems Level Management- Air Cooling and Heat Pipes
12 Systems Level Management ? Single and Two-Phase Fluid Cooling
Composite substrates
Erscheinungsdatum | 10.07.2023 |
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Verlagsort | Berlin |
Sprache | englisch |
Maße | 1700 x 2440 mm |
Themenwelt | Technik ► Elektrotechnik / Energietechnik |
ISBN-10 | 3-527-41348-0 / 3527413480 |
ISBN-13 | 978-3-527-41348-5 / 9783527413485 |
Zustand | Neuware |
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