VLSI Design - Debaprasad Das

VLSI Design

(Autor)

Buch | Softcover
660 Seiten
2015 | 2nd Revised edition
OUP India (Verlag)
978-0-19-809486-9 (ISBN)
27,40 inkl. MwSt
The second edition of VLSI Design is a comprehensive textbook designed for undergraduate students of electrical, electronics, and electronics and communication engineering. It provides a thorough understanding of the fundamental concepts and design of VLSI systems.
Beginning with an introduction to VLSI systems and basic concepts of MOS transistors, this second edition of the book then proceeds to describe the various concepts of VLSI, such as the structure and operation of MOS transistors and inverters, standard cell library design and its characterization, analog and digital CMOS logic design, semiconductor memories, and BiCMOS technology and circuits. It then provides an exhaustive step-wise discussion of the various stages involved in designing a VLSI chip (which includes logic synthesis, timing analysis, floor planning, placement and routing, verification, and testing). In addition, the book includes chapters on FPGA architecture, VLSI process technology, subsystem design, and low power logic circuits.

Debaprasad Das is an Associate Professor and Head of the Department of Electronics and Telecommunication Engineering, Assam University, Silchar. Dr. Das obtained his PhD from School of VLSI Technology, Bengal Engineering and Science University (now Indian Institute of Engineering Science and Technology, IIEST an institute of National importance), Shibpur. He has five years of industry experience and about ten years of teaching experience at both undergraduate and postgraduate levels. Dr. Das has published several research articles in reputed international journals and conferences.

Preface; Preface to the First Edition; List of Colour Plates; 1 Introduction to VLSI Systems; 1.1 Historical Perspective; 1.2 Introduction to IC Technology; 1.3 Types of Integrated Circuits; 1.4 Design Methodology; 1.5 Design DomainsY-Chart; 1.6 Hierarchical Abstraction; 1.7 Design Flow; 1.8 Design Styles; 1.9 Computer-aided Design; 1.10 CMOS Integrated Circuit; 1.11 Issues with Integrated Circuits at the DSM Level;
1.12 Modelling and Simulation; 1.13 Design Metrics; 1.14 Cost of Integrated Circuits; 1.15 CAD Tools for VLSI Design; 1.16 VLSI Design using Computer-aided Design Tools; 1.17 Problems in VLSI CAD Domain; 1.18 IC Chip IndustryA Brief Outlook; 1.19
Recent Developments and Future Projections; 2 MOS Transistors; 2.1 Introduction to Semiconductor Devices; 2.2 Charge Carriers in Semiconductors; 2.3 Parallel Plate Capacitor; 2.4 MOS Capacitor; 2.5 MOS Transistor; 2.6 MOSFET Threshold Voltage; 2.7 MOSFET Current Equation; 2.8 MOSFET V-I Characteristics; 2.9 MOSFET Scaling; 2.10 Small Geometry Effects; 2.11 MOSFET Capacitances; 2.12 MOSFET Modelling; 3 MOS Inverters; 3.1 Introduction; 3.2 Voltage Transfer
Characteristics; 3.3 Resistive Load Inverter; 3.4 Enhancement-type nMOS Load Inverter; 3.5 Depletion-type nMOS Load Inverter; 3.6 CMOS Inverter; 3.7 Design of Symmetric Inverter; 3.8 Transient Analysis of CMOS Inverter; 3.9 Power Supply
Voltage Scaling in CMOS Inverter; 4 Standard Cell Library Design and Characterization; 4.1 Introduction; 4.2 Standard Cell Library; 4.3 Schematic Design; 4.4 Layout Design; 4.5 Layout versus Schematic; 4.6 Extraction from Layout; 4.7 Antenna Effect; 4.8 Standard Cell Library Data; 4.9 Library Characterization; 4.10 Cell Characterization; 4.11 Circuit Simulation; 4.12 Measuring the Propagation Delay; 4.13 Measuring Rise and Fall Time; 4.14 Ring Oscillator; 4.15 Load/Slew
Characterization Table; 4.16 Power Characterization; 4.17 Reliability and Noise Characterization; 4.18 Interconnect Delay Modelling; 5 Analog CMOS Design; 5.1 Introduction; 5.2 MOSFET Small Signal Model; 5.3 MOSFET as a
Switch; 5.4 MOS Diode/Resistor; 5.5 Small Signal Analysis of Single Stage Amplifiers; 5.6 MOS Current Source and Sink; 5.7 Current Mirror; 5.8 Resistor Realization Using Switched Capacitor; 5.9 MOS Voltage and Current References; 5.10 CMOS Amplifier; 5.11 MOS Differential Amplifier; 5.12 Cascode Amplifier; 5.13 Current Amplifier; 5.14 Output Amplifier; 5.15 Source Follower; 5.16 Voltage Level Shifter; 5.17 CMOS Operational Amplifier; 5.18 Comparator; 5.19 Switched Capacitor Filter; 5.20
Digital-to-Analog Converter; 5.21 Analog-to-Digital Converter; 5.22 Phase-locked Loop; 5.23 Field Programmable Analog Array; 6 Digital CMOS Logic Design; 6.1 Introduction; 6.2 Digital Logic Design; 6.3 CMOS
Logic Design; 6.4 CMOS Design Methodology; 6.5 Design of CMOS Inverter (NOT) Gate; 6.6 Design of Two-Input NAND Gate; 6.7 Design of Two-Input NOR Gate; 6.8 Classification of CMOS Digital Logic Circuit; 6.9 Combinational Logic Circuit; 6.10 Sequential Logic Circuit; 6.11 Pseudo-nMOS Logic; 6.12 CMOS Transmission Gate; 6.13 Dynamic CMOS Logic; 6.14 Domino CMOS Logic; 6.15 NORA CMOS Logic; 6.16 Zipper CMOS Logic; 6.17 True Single-phase Clock (TSPC) Dynamic CMOS Logic; 6.18 Pass Transistor Logic;
6.19 Complementary Pass Transistor Logic; 6.20 Voltage Bootstrapping; 6.21 Differential CMOS Logic; 6.22 Adiabatic Logic; 6.23 Dual-threshold CMOS Logic; 7 Semiconductor Memories; 7.1 Introduction; 7.2
Static RAM; 7.3 Dynamic RAM; 7.4 Read Only Memory; 7.5 Flash Memory; 7.6 Content Addressable Memory; 7.7 Design of CAM Architecture; 8 BiCMOS Technology and Circuits; 8.1 Introduction; 8.2 Comparison Between CMOS and BJTs; 8.3 BiCMOS Technology; 8.4 Bipolar Logic; 8.5 BiCMOS Logic Circuits; 8.6 BiCMOS Two-Inputs NAND Logic; 8.7 BiCMOS Two-inputs NOR Logic; 8.8 Complex Logic Using BiCMOS; 8.9 Applications of BiCMOS Circuits; 8.10 Disadvantages of BiCMOS; 8.11 SiliconGermanium
BiCMOS Technology; 9 Logic Synthesis; 9.1 Introduction; 9.2 Introduction to Synthesis; 9.3 Transistor-level or Circuit-level Synthesis; 9.4 Logic-level Synthesis; 9.5 Block-level Synthesis or Datapath Synthesis; 9.6
Logic Synthesis; 9.7 Algorithms; 9.8 Boolean Space; 9.9 Binary Decision Diagram (BDD); 9.10 Logic SynthesisAdvantages and Disadvantages; 9.11 How Does It Work?; 9.12 Sequential Logic Optimization; 9.13 Building Blocks for Logic Design; 10 Timing Analysis; 10.1 Introduction; 10.2 Delay in Any System; 10.3 Delay in VLSI Circuits; 10.4 Delay in CMOS Inverter; 10.5 Slew Balancing; 10.6 Transistor Equivalency; 10.7 Case Study: Effect of Transistor Size on Propagation Delay; 10.8
Design of Two-Inputs NAND Gate for Equal Rise and Fall Slew; 10.9 Design of Two-Inputs NOR Gate for Equal Rise and Fall Slew; 10.10 MOS Capacitances; 10.11 Dependency of Delay and Slew on Power Supply Voltage; 10.12
Design Techniques for Delay Reduction; 10.13 Intrinsic Delay of Inverter; 10.14 Inverter Sizing Effect on Propagation Delay; 10.15 Inverter Chain Design; 10.16 Effect of Input Slew on Propagation Delay; 10.17 Delay Dependence on Input Patterns; 10.18 Logical Effort; 10.19 Classification of Digital Systems; 10.20 Definitions of Timing Terms; 10.21 Timing Analysis; 10.22 Timing Models; 10.23 Timing Analysis Goals; 10.24 Timing Analysis at the Chip Level; 10.25 Static vs Dynamic Timing
Verification; 10.26 Factors Impacting Timing Delay; 10.27 Static Timing AnalysisCase Study; 10.28 Fixed Delay Model; 10.29 Checking Timing Constraints; 10.30 Timing Verification in Sequential Synchronous
Circuits; 10.31 Hierarchical Timing Specification and Verification; 10.32 Issues with Static Delay Modelling; 10.33 First-order Gate Delay Model; 10.34 Parasitic Extraction; 10.35 Timing Convergence Problem; 10.36 Timing-Driven Logic Synthesis; 10.37 Gate and Device Sizing; 10.38 Typical Delay-area Trade-off; 10.39 Timing-driven Layout Synthesis; 11 Physical DesignFloorplanning, Placement, and Routing; 11.1 Introduction; 11.2 Partitioning; 11.3 Floorplanning; 11.4 Placement;
11.5 Routing; 11.6 Types Of Routing; 11.7 Special Routing; 11.8 Multilevel Routing; 11.9 Physical Design EDA Tools; 11.10 Layout Database; 12 Verification and Reliability Analysis; 12.1 Introduction; 12.2 Verification
Methodologies in VLSI Design Flow; 12.3 Logic Verification; 12.4 Physical Verification; 12.5 Design Rule Check; 12.6 Layout Versus Schematic (LVS) Check; 12.7 Electrical Rule Check; 12.8 Antenna Check; 12.9 Metal Density Check; 12.10 Layout Extraction; 12.11 Crosstalk Analysis; 12.12 Introduction to Reliability; 12.13 IC ReliabilityDefinitions; 12.14 Reliability Issues in ICs; 12.15 Electromigration; 12.16 Time-dependent Dielectric Breakdown; 12.17 Channel Hot Electron; 12.18 Negative-bias
Temperature Instability; 12.19 IR Drop; 12.20 Latch-up; 12.21 Electrical Overstress and Electrostatic Discharge; 12.22 Soft Error; 13 IC Packaging; 13.1 Introduction; 13.2 Types of IC Packages; 13.3
Package Modelling; 13.4 Electrical Package Modelling; 13.5 IC Package Thermal Modelling; 13.6 IC Package Stress Modelling; 13.7 Package Models; 13.8 Package Simulation; 13.9 Flip-chip Package; 14 VLSI Testing; 14.1 Introduction; 14.2 Importance of Testing; 14.3 Fault Models; 14.4 Fault Simulation; 14.5 Design for Testability; 14.6 Ad Hoc Testing; 14.7 Scan Test; 14.8 Boundary Scan Test; 14.9 Built-in Self Test; 14.10 Automatic Test-pattern Generation; 14.11 IDDQ Test; 14.12
Design for Manufacturability (DMF); 14.13 Design Economics; 14.14 Yield; 14.15 Probe Test; 15 Field Programmable Gate Array; 15.1 Introduction; 15.2 Programmable Logic Devices; 15.3 Sequential PLD; 15.4 Complex PLD; 15.5
Field Programmable Gate Array; 15.6 Xilinx SRAM-based FPGA; 15.7 Comparison between FPGA, ASIC, and CPLD; 15.8 FPGA-based System Design; 15.9 IRSIM; 15.10 Generalized Open Source Programmable Logic; 16 VLSI Process Technology; 16.1 Introduction; 16.2 Crystal Growth; 16.3 Photolithography; 16.4 CMOS Technology: n-well and p-well Process; 16.5 Oxidation; 16.6 Diffusion; 16.7 Ion Implantation; 16.8 Etching; 16.9 Epitaxial Growth; 16.10 Metallization; 16.11 Packaging; 17
Subsystem Design; 17.1 Introduction; 17.2 Adders; 17.3 Multipliers; 17.4 Drivers and Buffers; 18 Low Power Logic Circuits; 18.1 Introduction; 18.2 Power Dissipation in Logic Circuits; 18.3 Power Reduction Techniques; 18.4 Low
Power Design Techniques; Appendix A Digital Design Using VHDL; Appendix B Digital Design Using Verilog; Appendix C SPICE Tutorial; Appendix D Answers to Objective-type Questions

Erscheinungsdatum
Zusatzinfo 497 Illustrations
Verlagsort New Delhi
Sprache englisch
Maße 162 x 244 mm
Gewicht 788 g
Themenwelt Technik Elektrotechnik / Energietechnik
ISBN-10 0-19-809486-8 / 0198094868
ISBN-13 978-0-19-809486-9 / 9780198094869
Zustand Neuware
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