Handbook of Machining with Grinding Wheels

Brian Rowe is considered the father of centerless grinding in addition to other notable research on grinding that includes thermal aspects, dynamic aspects, and fluid-film bearings. He established a laboratory and school dedicated to manufacturing processes at Liverpool John Moores University and is an Emeritus Professor. Ichiro Inasaki is the dean of the Graduate School of Science and Technology at Keio University, Japan. He has developed a laboratory with outstanding research activities and his "intelligent grinding wheel" is featured in the Noritake Museum and represents one of his best accomplishments and contributions. He led CIRP in 2004/2005 as the president and was granted several awards. Eckart Uhlmann is professor and director of the Institute for Machine-Tools and Management at Technical University of Berlin, Germany. Dr. Uhlmann received this chaired professorship after a very successful industrial career with Hermes Abrasive in Germany. As the head of his institute he holds the leading position in research on all aspects of abrasive machining with grinding wheels. Dr. Mike Hitchiner is manager of precision technology at Saint Gobain Abrasives (Norton), the largest grinding wheel company in the world. Mike has devoted all his life to research, development and practical application of grinding processes. He started this activity during his D Phil at the University of Oxford in England, and was later considered "Mr. CBN Grinding" by the precision grinding industry. Today he focuses on working with machine tool builders and developing new grinding processes. He has brought an important industrial perspective to this book, as well as hundreds of applications.

THE BASIC PROCESS OF GRINDING. Introduction. Grinding Parameters. Material Removal Mechanisms. Grinding Wheels. The Nature of the Abrasive. Specification of the Bond. Dressing. Grinding Dynamics. Grinding Wheel Wear. Coolants, the Coolant System, and Cooling. Monitoring of Grinding Processes. Economics of Grinding. APPLICATION OF GRINDING PROCESSES. Grinding of Ductile Materials. Grinding of Ceramics. Grinding Machine Technology. Surface Grinding. External Cylindrical Grinding. Internal Grinding. Centerless Grinding. Ultrasonic-Assisted Grinding. Glossary. Appendix: Notation and Use of SI Units.