Carbon Nanotube Based VLSI Interconnects (eBook)
XI, 86 Seiten
Springer India (Verlag)
978-81-322-2047-3 (ISBN)
Brajesh Kumar Kaushik is currently working as Associate Professor in Department of Electronics and Communication Engineering, Indian Institute of Technology Roorkee, Roorkee, India. Dr. Kaushik has completed his PhD from Indian Institute of Technology Roorkee in 2007. His research interests include Signal Integrity, Propagation Delay, and Power Dissipation of VLSI Interconnects; Low Power VLSI Design; Electronic Design Automation (EDA)-Circuit and Systems-CAD. Dr. Kaushik has authored more than 60 papers in peer reviewed international journals and over 80 papers in international Conferences. He has also authored many book chapters, which includes 3 chapters in Springer books. Dr. Kaushik is also an Editor-in-Chief of VLSI Design & Communication System (VLSICS) and Editor of Journal of Electrical and Electronics Engineering Research (JEEER), Academic Journals and Journal of Engineering, Design and Technology (JEDT), Emerald.
Manoj Kumar Majumder, Research Scholar, is currently pursuing his PhD from Indian Institute of Technology, Roorkee, India. Prior to this, he completed his BTech from Dr. B. C. Roy Engineering College, Durgapur in 2007 and M.Tech from Bengal Engineering and Science University, Shibpur in 2009. He has also worked as lecturer in Department of Electronics and Communication Engineering at Durgapur Institute of Advanced Technology and Management (DIATM), West Bengal. He has one book chapter and several journal and conference publications to his credit.
The brief primarily focuses on the performance analysis of CNT based interconnects in current research scenario. Different CNT structures are modeled on the basis of transmission line theory. Performance comparison for different CNT structures illustrates that CNTs are more promising than Cu or other materials used in global VLSI interconnects. The brief is organized into five chapters which mainly discuss: (1) an overview of current research scenario and basics of interconnects; (2) unique crystal structures and the basics of physical properties of CNTs, and the production, purification and applications of CNTs; (3) a brief technical review, the geometry and equivalent RLC parameters for different single and bundled CNT structures; (4) a comparative analysis of crosstalk and delay for different single and bundled CNT structures; and (5) various unique mixed CNT bundle structures and their equivalent electrical models.
Brajesh Kumar Kaushik is currently working as Associate Professor in Department of Electronics and Communication Engineering, Indian Institute of Technology Roorkee, Roorkee, India. Dr. Kaushik has completed his PhD from Indian Institute of Technology Roorkee in 2007. His research interests include Signal Integrity, Propagation Delay, and Power Dissipation of VLSI Interconnects; Low Power VLSI Design; Electronic Design Automation (EDA)-Circuit and Systems-CAD. Dr. Kaushik has authored more than 60 papers in peer reviewed international journals and over 80 papers in international Conferences. He has also authored many book chapters, which includes 3 chapters in Springer books. Dr. Kaushik is also an Editor-in-Chief of VLSI Design & Communication System (VLSICS) and Editor of Journal of Electrical and Electronics Engineering Research (JEEER), Academic Journals and Journal of Engineering, Design and Technology (JEDT), Emerald.Manoj Kumar Majumder, Research Scholar, is currently pursuing his PhD from Indian Institute of Technology, Roorkee, India. Prior to this, he completed his BTech from Dr. B. C. Roy Engineering College, Durgapur in 2007 and M.Tech from Bengal Engineering and Science University, Shibpur in 2009. He has also worked as lecturer in Department of Electronics and Communication Engineering at Durgapur Institute of Advanced Technology and Management (DIATM), West Bengal. He has one book chapter and several journal and conference publications to his credit.
Interconnects.- Carbon Nanotube – Properties and Applications.- Modeling of Carbon Nanotube Interconnects.- Crosstalk and Delay Analysis.- Mixed Carbon Nanotube Bundle.- References.
Erscheint lt. Verlag | 1.11.2014 |
---|---|
Reihe/Serie | SpringerBriefs in Applied Sciences and Technology |
Zusatzinfo | XI, 86 p. 57 illus. |
Verlagsort | New Delhi |
Sprache | englisch |
Themenwelt | Technik ► Elektrotechnik / Energietechnik |
Technik ► Maschinenbau | |
Schlagworte | Carbon Nanotube • Delay and Signal Integrity • Mixed Carbon Nanotube Bundle • Modeling • Types of Interconnects • VLSI Design |
ISBN-10 | 81-322-2047-1 / 8132220471 |
ISBN-13 | 978-81-322-2047-3 / 9788132220473 |
Haben Sie eine Frage zum Produkt? |
Größe: 5,4 MB
DRM: Digitales Wasserzeichen
Dieses eBook enthält ein digitales Wasserzeichen und ist damit für Sie personalisiert. Bei einer missbräuchlichen Weitergabe des eBooks an Dritte ist eine Rückverfolgung an die Quelle möglich.
Dateiformat: PDF (Portable Document Format)
Mit einem festen Seitenlayout eignet sich die PDF besonders für Fachbücher mit Spalten, Tabellen und Abbildungen. Eine PDF kann auf fast allen Geräten angezeigt werden, ist aber für kleine Displays (Smartphone, eReader) nur eingeschränkt geeignet.
Systemvoraussetzungen:
PC/Mac: Mit einem PC oder Mac können Sie dieses eBook lesen. Sie benötigen dafür einen PDF-Viewer - z.B. den Adobe Reader oder Adobe Digital Editions.
eReader: Dieses eBook kann mit (fast) allen eBook-Readern gelesen werden. Mit dem amazon-Kindle ist es aber nicht kompatibel.
Smartphone/Tablet: Egal ob Apple oder Android, dieses eBook können Sie lesen. Sie benötigen dafür einen PDF-Viewer - z.B. die kostenlose Adobe Digital Editions-App.
Buying eBooks from abroad
For tax law reasons we can sell eBooks just within Germany and Switzerland. Regrettably we cannot fulfill eBook-orders from other countries.
aus dem Bereich