Materials for High-Density Electronic Packaging and Interconnection

1 FRONT MATTER; 2 EXECUTIVE SUMMARY; 3 1 INTRODUCTION; 4 2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS; 5 3 PACKAGING STRATEGIES AND ASSOCIATED MATERIALS AND PROCESS REQUIREMENTS; 6 4 MATERIALS ISSUES; 7 5 SOME SPECIFIC MATERIALS; 8 6 ORGANIZATIONAL, FUNDING, AND POLICY ISSUES; 9 APPENDIX A: GLOSSARY OF SOME TERMS AND ACRONYMS USED IN THE REPORT; 10 APPENDIX B: SOME INDUSTRY COMPONENT DATA; 11 APPENDIX C: MICROPROCESSOR OPERATING AND STRUCTURAL PARAMETERS; 12 APPENDIX D: EXAMPLES OF DEVELOPMENTS IN BOARD TECHNOLOGIES; 13 APPENDIX E: MATERIALS PROPERTIES; 14 APPENDIX F: EXAMPLES OF MULTICHIP MODULES; 15 APPENDIX G: BIOGRAPHICAL SKETCHES OF COMMITTEE MEMBERS