11th International Congress Molded Interconnect Devices – Scientific Proceedings
Seiten
2014
Trans Tech Publications Ltd (Hersteller)
978-3-03795-948-0 (ISBN)
Trans Tech Publications Ltd (Hersteller)
978-3-03795-948-0 (ISBN)
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Selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany
Collection of selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany.
The 16 papers are grouped as follows:
Chapter 1: Development and Prototyping,
Chapter 2: Printing Technologies,
Chapter 3: Materials and Manufacturing,
Chapter 4: Manufacturing Processes,
Chapter 5: Assembly Technologies and Inspection,
Chapter 6: Quality and Reliability.
Collection of selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany.
The 16 papers are grouped as follows:
Chapter 1: Development and Prototyping,
Chapter 2: Printing Technologies,
Chapter 3: Materials and Manufacturing,
Chapter 4: Manufacturing Processes,
Chapter 5: Assembly Technologies and Inspection,
Chapter 6: Quality and Reliability.
Reihe/Serie | Advanced Materials Research ; Volume 1038 |
---|---|
Verlagsort | Zurich |
Sprache | englisch |
Maße | 125 x 142 mm |
Gewicht | 200 g |
Themenwelt | Technik ► Maschinenbau |
ISBN-10 | 3-03795-948-7 / 3037959487 |
ISBN-13 | 978-3-03795-948-0 / 9783037959480 |
Zustand | Neuware |
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