This Expert Guide gives you the knowledge, methods and techniques to develop and manage embedded systems successfully. It shows that teamwork, development procedures, and program management require unique and wide ranging skills to develop a system, skills that most people can attain with persistence and effort.
With this book you will:
- Understand the various business aspects of a project from budgets and schedules through contracts and market studies
- Understand the place and timing for simulations, bench tests, and prototypes, and understand the differences between various formal methods such as FMECA, FTA, ETA, reliability, hazard analysis, and risk analysis
- Learn general design concerns such as the user interface, interfaces and partitioning, DFM, DFA, DFT, tradeoffs such as hardware versus software, buy versus build, processor choices, and algorithm choices, acquisition concerns, and interactions and comparisons between electronics, functions, software, mechanics, materials, security, maintenance, and support
- Covers the life cycle for developing an embedded system: program management, procedures for design and development, manufacturing, maintenance, logistics, and legal issues
- Includes proven and practical techniques and advice on tackling critical issues reflecting the authors' expertise developed from years of experience
This Expert Guide gives you the knowledge, methods and techniques to develop and manage embedded systems successfully. It shows that teamwork, development procedures, and program management require unique and wide ranging skills to develop a system, skills that most people can attain with persistence and effort. With this book you will: Understand the various business aspects of a project from budgets and schedules through contracts and market studies Understand the place and timing for simulations, bench tests, and prototypes, and understand the differences between various formal methods such as FMECA, FTA, ETA, reliability, hazard analysis, and risk analysis Learn general design concerns such as the user interface, interfaces and partitioning, DFM, DFA, DFT, tradeoffs such as hardware versus software, buy versus build, processor choices, and algorithm choices, acquisition concerns, and interactions and comparisons between electronics, functions, software, mechanics, materials, security, maintenance, and support Covers the life cycle for developing an embedded system: program management, procedures for design and development, manufacturing, maintenance, logistics, and legal issues Includes proven and practical techniques and advice on tackling critical issues reflecting the authors' expertise developed from years of experience
Front Cover 1
Developing and Managing Embedded Systems and Products 4
Copyright Page 5
Contents 6
List of Contributors 24
About the Editor 26
Co-Author Biography 27
Author’s Biographies 28
Chapter Authors 28
Case Study Authors 30
Developing and Managing Embedded Systems and Products: The Roadmap 34
Chapter 1: Introduction to Good Development 34
Chapter 2: Drivers of Success in Engineering Teams 34
Chapter 3: Project Introduction 35
Chapter 4: Dealing with Risk 36
Chapter 5: Documentation 36
Chapter 6: System Requirements 36
Chapter 7: Analyses and Tradeoffs 37
Chapter 8: The Discipline of System Design 37
Chapter 9: Mechanical Design 37
Chapter 10: Electronic Design 37
Chapter 11: Software Design and Development 38
Chapter 12: Security 38
Chapter 13: Review 38
Chapter 14: Test and Integration 39
Chapter 15: Manufacturing 39
Chapter 16: Logistics, Distribution, and Support 39
Chapter 17: Agreements, Contracts, and Negotiations 40
Chapter 18: Dealing with the Government 40
Chapter 19: Agency and Getting Paid 40
Chapter 20: Intellectual Property etc. 40
Chapter 21: Open Source Software 41
Chapter 22: Laws That Can Nail Embedded Engineers 41
Chapter 23: Corporate Operations, Export, and Compliance 41
Chapter 24: Case Studies 41
List of Acronyms 43
1 Introduction to Good Development 48
About this book 49
Purpose 49
Audience 50
Road map 51
What you can get from this book 51
What you won’t get from this book 54
Definitions and some basic concepts 54
Focus 55
Five guiding principles 56
No silver bullets 56
Feedback stabilizes 56
Interfaces are important 56
All problems have a human origin 57
Good development and engineering require good relationships 57
Reliability, fault avoidance and tolerance, and error recovery 57
The business case 58
Life cycle 58
Types of markets and development 59
Recent research 59
Team attributes 59
Working together 59
Individual assignments 60
Relating together 61
Attributes of a good manager 62
Attributes of good technical and support staff 62
TLC’ed 63
Ethics 63
Success and failure 63
Systems engineering 65
INCOSE Systems Engineering Handbook 68
NDIA and SEI report 69
NASA report on cost escalation 69
NASA Systems Engineering Handbook 69
Various approaches to development processes 70
Process models for development 70
V-Model 70
Spiral model 71
Prototyping model 73
PERRU 73
Quality Assurance (QA) 73
ISO 9001 74
Six Sigma 76
Capability Maturity Model Integration (CMMI) 76
Comparison between ISO 9001 and CMMI 77
Life cycle phases 79
Concept 79
Preliminary 79
Critical 79
Test and integration 79
Compliance and system acceptance 80
Production 80
Shipping and delivery 80
Operations and support 80
Disposal 80
Case Study: Disastrous engineering processes fixed 80
The good 82
The bad 82
The ugly 82
The turn around 83
Trials and tribulations 83
The final product 84
Conclusion 84
Acknowledgments 84
References 84
Suggested reading 85
2 Drivers of Success in Engineering Teams 86
Overview of organizational and psychological drivers 87
Take a panoramic view of your workplace 87
Step on the three-legged stool 88
The role of the team member 88
Expectations of team members 88
Team player redefined 88
Some common expectations 89
Characteristics of high performers 90
Managing priorities 91
Learning with agility 91
The role of the team leader 92
The team leader’s role in managing change 92
Responses to change in the workplace 93
Change and loss 94
Individual patterns of response 96
Change and future focus 97
Aligning yourself with organizational goals and strategy 98
Organizational mission and priorities 98
Self-awareness and assessment 99
Leader self-awareness and style 99
The power of personality 100
Leader style 100
The 360° perspective—soliciting feedback 101
Blind spots 101
Establishing essential relationships 101
Identifying your stakeholders 101
Relationship building 102
Functional and project manager tension 102
Team development 102
Building blocks for team development 102
Critical team member needs 103
Diversity and inclusion 104
Phases of group development 104
Engagement and the motivational environment 105
What is engagement? 105
What contributes to engagement? 106
Motivational elements 106
Value and recognition 106
Clear expectations 107
Development 107
Team engagement 108
The power of dialogue 108
Challenging conversations 108
Enhancing success with emotional intelligence 110
What is emotional intelligence? 110
Elements of emotional intelligence 111
Handling conflict 112
Group conflict 113
Interpersonal conflict 114
Further development 115
References 115
3 Project Introduction 118
Overview 119
Establishing the vision, mission, goals, and objectives 119
The lineage and the progression 119
Vision—where you are heading 120
Mission—your fundamental purpose 121
Goals—measurable components 122
Objectives—action steps to meet goals 123
Establish the team 123
Define the roles 124
Project sponsor 124
Project manager 124
Project team members 125
Assemble a core project team 125
Communication is key to the team 125
Communications 125
Forms of communication 126
Stakeholders 126
Communication plan 126
Social contracts 126
Business case 128
Understand the market 129
Understand the customer 130
Business plan 131
Business administration and concerns 132
Scheduling and budgeting 132
Estimating accurately 132
A word of warning 134
Effort to introduce a project 134
Acknowledgement 134
Recommended reading 134
References 134
4 Dealing with Risk 136
Overview 137
Who performs risk management? 138
When is risk management done? 139
How is risk management done? And why? 139
Hazard analysis within risk management 139
Definitions 140
Risk analysis and management 141
Margin analysis and management 141
Hazard analysis 149
Criticisms of probabilistic risk assessment 150
Types of problems 152
Failure 152
Technical failure 152
Professional failure 154
Production failure 155
Commercial and marketing failure 155
Failure from societal change 155
Steps that you can take 155
Disasters and catastrophes 156
Intrusion, sabotage, theft, and destruction 157
Contingency planning 157
Configuration management 157
Assess impact and priorities 158
Recovery 158
If recovery is not possible 159
Outsourcing 159
Change course 159
Sell or merge 159
Bankruptcy 159
Effort to manage risk 159
Acknowledgement 160
References 160
5 Documentation 162
Overview and rationale 162
Function 163
Types and content 165
When, who, and what 165
Document formats 169
Document contents 171
Project plan outline 171
Design plan outline 172
Requirements’ examples 173
Outlines of design descriptions with examples 175
Operations, data flow, and software design description 176
Electrical and electronic design description 176
Mechanical and materials design description 177
Test plan example outline 178
Examples of test procedures 179
User’s manual example outline 179
Summary and parting thoughts 179
Recommended reading 180
References 180
Appendix A: Examples from a test plan 180
Development tests to verify design and development 180
Electrical and electronic test procedures 180
Software test procedures 181
Mechanical–structural test procedures 182
Mechanical—mechatronic test procedures 183
Optical test procedures 184
Support equipment test procedures 184
Integration test procedures 186
Functional integration procedures 186
Engineering model testbed integration procedures 187
System integration procedures 188
Environmental test procedures 188
Some test plans have a manufacturing section—here is an example 188
Acceptance test procedures 189
Installation test procedures 189
Appendix B: Examples of test procedures 190
Introduction 190
Mechanical, packaging, and cabling test scripts 190
Size, volume, and weight 190
Connector policies 191
Cabling policies 193
Shielding 194
Software processes test scripts 199
Development processes 199
Development metrics and rates 200
Error rates and defect records 201
Hardware test scripts 201
Performance 201
Memory size 202
Download and test ports 203
Power 204
6 System Requirements 206
Definitions 206
Developing and managing requirements 207
Customer interpretation of requirements 209
Requirement categories 209
Functional versus nonfunctional requirements 209
System architecture requirements 212
Requirements’ attributes 213
Common risks in setting requirements 214
Process and QA 214
Domains and properties 215
Setting boundaries 216
Framing the system for requirements definition 217
Information problems 217
Control problems 220
Transformation systems 221
Workpiece 222
Connection 222
Use cases 222
Prioritizing requirements 228
Recommendations to reduce requirements’ risks 230
Mike Gard: thoughts on developing requirements 232
Oshana’s Maxim—estimating requirements’ efforts 234
Acknowledgments 234
References 235
Recommended reading 235
7 Analyses and Tradeoffs 236
Introduction 237
Why analysis? 237
When to analyze? 238
How is analysis used? 238
Where are analyses performed? 239
Who analyzes? 239
Risk management 239
The business case 239
Time and money 240
NRE and COGS 240
Tradeoffs 242
Design tradeoffs 243
Control: Software versus electronic versus mechanical 246
Number of features 247
Buy versus build 248
Dependability—reliability versus fault tolerance versus availability 248
Explicit versus implicit 250
Manufacturing tradeoffs 250
Logistics and support tradeoffs 251
Use cases 251
Design analyses 253
Physical forms of analysis 253
Simulations 253
Bench (or laboratory) tests 255
Prototypes 255
Formal analysis techniques 255
Types and when used 255
Proactive analyses 256
Failure modes effects criticality analysis 256
Fault tree analysis 259
Event tree analysis 263
Dependability 266
System theoretic process analysis 266
Safety cases 271
Comparison between analyses 272
Further analyses for specific applications 275
Sneak circuit analysis 275
Petri net analysis 276
Barrier analysis 276
Bent pin analysis 277
Markov analysis 277
Root cause analysis (RCA) 277
RCA find 278
RCA fix 279
RCA change 279
Final case study 279
Acknowledgment 280
References 280
Recommended reading 281
8 The Discipline of System Design 282
What to expect in this chapter 284
Basic definitions 285
What is a system? 285
What is system design? 285
How does system design fit into a project? 286
Who should do the system design? 287
Project manager 287
Committee 287
Systems engineer 290
Human elements in system design 291
The systems designer’s skill set 291
Language differences 292
System design flow steps 294
Business concerns 294
The cost of money 295
The cost of time 296
The cost of opportunity 296
NRE, tooling, and COGS costs 297
Overhead 300
Human factors 300
The art of system design 301
Understand system purpose and requirements 301
Business as a foreign language 302
Prepare use cases 303
The importance of early prototypes 305
The importance of frequent prototypes 308
Analyze requirements for feasibility and cost 309
Partition system design into modules 310
Requirements budgeting 312
Elaborating and tracking requirements 314
Design for this and that 315
Design for life cycle 315
Design for production volume 316
Design for maintenance 316
Design for upgrade 317
Design for part obsolescence 319
Design for manufacturing 323
Design for anything 325
System design choices 326
Build versus buy—contributed by Kim R. Fowler 327
Definitions 327
Custom design 328
COTS 328
Tradeoffs: parameters of build versus buy 329
Cost 330
Quantity 334
Time 336
Product longevity 337
Specifications and product complexity 338
Resources 339
Technical support and training 340
Other issues 341
How to pick a COTS vendor 342
Marketing hype 343
Approaching a design 344
Processor 346
Algorithms 346
Signal processing chains 347
Apportioning among disciplines 349
Finding parts 353
Build versus buy tradeoffs 353
Buying off the shelf 355
Repurposing of parts 357
Buying custom-made subsystems 359
Counterfeit parts 362
System analysis and test 362
System modeling 362
Modeling from theory 362
Testing and refining models 365
Analysis 367
Static and dynamic analysis 367
Finding symbolic solutions 370
Numerical analysis 371
Testing physical models 372
Worst-case, nominal, and statistical analysis 373
Types of analysis to perform 374
References 375
9 Mechanical Design 376
What to expect from this chapter 377
Materials 377
Fasteners 382
Goals for choosing fasteners 383
Fastener types 383
Fastener sizes 387
Preload 388
Fabrication 389
Finishes 391
Packaging 394
Enclosures 395
Connectors and cabling 395
Vibration and mechanical shock 400
Thermal cycling 401
Thermal design 402
Thermal design during the concept phase 404
Define the external shape and estimate maximum power dissipation 406
Estimate overall power and identify power sources 408
Develop plan for thermal heat paths 408
RFI/EMI shielding 409
Cooling of CPU/MPUs 410
Air cooled heat sink design 410
Natural convection heat sinks 411
Selecting a cooling fan 411
Reliability considerations with cooling fans 413
Minimizing noise from fans 413
Heat pipes 415
Mechanisms 416
Analysis and test 429
Finite element analysis 434
Vibration analysis 437
References 444
Suggested reading 444
10 Electronic Design 446
Overview of electronic design 447
Requirements 448
General processes and procedures 448
Specific requirements 448
Circuit design 450
Components 450
Resistors 451
Wirewound resistors 457
The lowly pullup and pulldown resistor 459
Potentiometers and digital potentiometers 459
Capacitors 462
Ceramic capacitors 462
Electrolytic capacitors 464
Tantalum capacitors 466
Film capacitors 466
Silver mica capacitors 467
Inductors 468
Semiconductors 469
Visual displays 471
Lamps and LEDs 471
Display devices 472
Integrated circuits 473
Processors and controllers 473
Power semiconductors 476
Analog semiconductors 480
Digital and mixed-signal semiconductors 482
Circuit boards 482
Connectors, cables, and conductors 484
Connectors 484
Cabling 488
Conductors 490
Connections 490
Operating life (MTBF) 491
Power and power consumption 492
An aside about power consumption 492
Line-operated power supplies 493
Battery-operated and alternative energy systems 494
Notes about unipolar and bipolar (single-ended and double-ended) power supplies 495
Cooling 497
Environmental extremes 500
RFI, EMI, and EMC compliance 501
Analysis methods 502
Worst case 502
Simulation 502
Monte Carlo simulations 503
Testing, qualifications, and conflicts 503
Bench tests 503
RFI, EMI, and EMC field tests 504
Environmental tests 504
Potential conflicts 505
Cost versus performance versus schedule 505
Power versus operating life 506
Size versus function versus cost 507
Built-in self-test 511
Acknowledgment 513
References 513
11 Software Design and Development 516
Distinguishing characteristics 518
Minimal operating system support 519
Real-time requirements 520
Real world sensor and actuator interfaces 520
Resource constrained 520
Single purpose 521
Long life cycle 522
Reliability and design correctness 523
Safety 523
Standards and certification 524
Cost 524
Product volume 525
Specialized knowledge 525
Security 526
The framework for developing embedded software 526
Processes and standards 528
One size doesn’t fit all 529
Process improvement 530
Process overhead 531
Process compliance 532
ISO 12207 reference process 534
Recommended process documents 534
Requirements engineering 538
Version control 540
Effort estimation and progress tracking 543
Life cycle 545
Tools and techniques 547
Real-time operating systems 547
Design by Contract 549
Drawings 551
Static source code analysis 552
Review 554
Test, verification, and validation 559
Conclusion 561
References 561
12 Security 562
Overview 562
Correctness, safety, and security 563
Security and you (the developer) 563
Other players 564
Definitions 564
Cryptography 565
Careful design and review 565
Desired properties 566
Assumptions 567
Roots of trust and the Trusted Computing Base (TCB) 568
Bootstrapping and extending trust 569
Security engineering 569
Art versus science 569
Defining security requirements 570
Reconciling security with functional requirements 571
Planning for inevitable security failures 572
Building a secure system 573
Security and process standards 573
Component (COTS) reuse 574
Testing 574
Chapter references 580
Suggested reading 581
13 Review 582
Introduction to review 583
Part of a complete feedback system 584
PERRU 584
Review is necessary 584
General processes and procedures 585
General outline for review 586
Tailoring your review 587
Types of review 588
Frequency of review 589
Course of action, changes, and updates following review 589
Roles and responsibilities 589
Components of a review 590
Agenda 590
Minutes 592
Action items 593
Checklist 593
Peer review and inspection 595
Internal review 595
Formal design review 596
Types of design reviews 596
Conceptual design review 596
Preliminary design review 598
Critical design review 599
Commercial release 600
Other types of design reviews 601
Change control board 602
Failure review board 602
Audits and customer reviews 602
Static versus dynamic analysis 603
Debrief 603
Acknowledgments 603
References 604
14 Test and Integration 606
Introduction 607
The reasons for testing and integration 607
Part of a complete feedback system 609
The goals for a complete test and integration program 610
Overview of test and integration 611
Bench tests 611
Mockups and fit checks 611
Unit and module tests 612
Fault injection tests 612
Verification and validation 612
Integration 613
Calibration and alignment checks 613
Field tests or trials 613
Compliance 613
Environmental tests 613
Security tests 614
Stress 614
Highly accelerated life test 614
When to use which tests 614
No simulation or manufacturing tests here 614
General processes and procedures 614
Test plan 615
Contributors to a test plan 617
Elements of a test plan 617
Verification 617
Validation 620
Field trial and testing 622
Integration 623
Calibration and alignment checks 624
Environmental tests 624
Thermal cycling, chamber testing 625
Vibration and shock 628
Humidity, condensation, and salt spray, chamber testing 633
Other concerns 634
Stress testing 634
Highly accelerated life test 635
Compliance testing 635
Aerospace 635
FDA 636
Underwriters Laboratory 636
CE marking 636
Military 638
Other issues to consider 638
Measurement science 638
Automation versus skilled manual test 639
Manufacturing test 639
Acknowledgment 639
References 640
Suggested reading 640
15 Manufacturing 642
Overview of manufacturing 643
Some philosophical issues with manufacturing 644
General processes and procedures 647
Electrical and electronic 647
Mechanical 649
Fabrication 649
Assembly 649
Tests and inspections 649
Production handoff 649
Specifics of fabrication and assembly 650
Electronic circuit boards 650
Basic definitions 650
Fabricating PWBs 652
Fabricating and assembling commercial circuit boards 653
Fabricating and assembling space-qualified circuit boards 661
Example fabrication for simple, space-qualified circuit boards 664
Example fabrication for complex, space-qualified circuit boards 666
Example fabrication for rigid–flex, space-qualified circuit boards 668
Summary comparison between different types of space-qualified circuit boards 668
Common manufacturing tradeoffs for space-qualified circuit boards 670
Some basic issues common to manufacturing space-qualified circuit boards 671
Fabricating and assembling military or industrial circuit boards 672
Electrical wires, cables, and harnesses 675
Mechanical 679
Materials 679
Enclosures and circuit board attachment 680
Mechanisms, fluids, and tubing 682
Module and subsystem attachment 683
Automated versus robotic versus manual 683
Production test 684
Electronics 684
Circuit boards 684
Cables and wires 685
Mechanical 685
ATE versus BIT versus BITE 686
Considerations in manufacturing 686
Quality systems 686
Standards 686
Supply chain 687
Contract manufacturing 687
Capabilities of contract manufacturing 688
Concerns for contract manufacturing 688
Selecting a contract manufacturer 689
Design transfer 693
Captive production facility 693
Acknowledgments 694
References 694
16 Logistics, Distribution, and Support 696
Overview of logistics, distribution, and support 697
Business logistics 698
Distribution logistics 698
Support 698
Maintenance and repair 699
Disposal 699
Definitions 699
Caveat 700
Market release 700
Distribution and delivery 700
Issues with distribution 701
Distribution centers 701
Order and delivery timing 702
Lean supply and flow control 702
Third-party logistics providers 702
It’s all about costs and time 702
Some comparisons of costs and delivery times for shipping 704
Some thoughts on warehouse costs 704
Packaging 706
Inventory 709
Sales support 710
Technical support 711
Tier 1, Tier 2, and Tier 3 711
Technical marketing 712
Training 712
Website 712
Users Manual 712
Tutorials 713
Maintenance and replenishment 713
Condition-based monitoring and maintenance 714
Predictive analytics 714
Some further issues in maintenance 715
Diagnosis and repair 715
Supportability 716
Recalls, patches, and updates 717
Reverse and green logistics and disposal 718
WEEE Directive 718
RoHS 718
Acknowledgment 719
References 719
Suggested reading 719
17 Agreements, Contracts, and Negotiations 720
Interpretation of contracts generally 720
The signing of agreements 723
The ubiquitous NDA 725
MOU means IOU 727
A word on negotiations of contracts 729
Humble negotiations with the Big Guy (reprinted with permission from the September 2001 IEEE Instrumentation and Measuremen... 732
A lop-sided negotiation 733
Commitment is gold 733
Stick to what you say 734
18 Dealing with the Government 736
Considerations in US federal government contracts 736
The government’s right to change 736
The government’s right to terminate 737
Ethical issues in government contracts 737
Some criminal statutes relevant to government contracting 738
The government contractor defense 739
19 Agency and Getting Paid 740
Agency 740
Why are agency relations so important? 740
Scope of agency 742
Getting paid 743
Documentary collection 744
Bankruptcy—what does his problem have to do with me? 745
20 Intellectual Property, Licensing, and Patents 748
Software licensing, source code, and somebody going broke 748
Software licensing in general 750
Protection of intellectual property 752
Copyrights and the embedded engineer 752
Protection of trade secrets 753
Trademarks 759
The use and misuse of trademarks 760
Patents 763
What is patentable and patent litigation 763
Beware the troll 770
Beware the non-troll 772
The America Invents Act 772
21 Open-Source Software 780
Best read in a Volkswagen minibus 780
Top 20 most commonly used licenses in open-source projects 784
Most recent projects to convert to GPLv3, LGPLv3, or AGPLv3 785
Public domain and shareware 785
Litigation and an open-source license 785
22 Laws That Can Nail Embedded Engineers 788
The Digital Millennium Copyright Act 788
Stored Communications Act 790
The Computer Fraud and Abuse Act 18 USC § 1030 790
Torts and the engineer 791
Negligence 791
Limiting exposure 792
Products liability 795
Public policy 795
Elements of products liability 796
Minimizing risk in embedded system product development 799
23 Corporate Operations 802
The charter 802
Shares and stocks 803
Hiring or contracting with foreigners 804
So you want to export 805
Bribery 805
Export restrictions 806
Cryptography issues 806
ITAR issues 807
Export of high-performance computers (Section 732.3 of the EAR) 807
Controls on HPC exports 808
Antiboycott considerations (ignoring, “I told you not to play with her!”) 809
Arbitration clauses under international contracts 809
Insurance 810
Compliance—or why won’t you comply? 811
Typical compliance certifications done by a representative US datacom manufacturer for new telecom products 811
CE mark 813
24 Case Studies 816
Introduction 816
Two case studies from the Oak Ridge National Laboratory: development of real-time instrumentation systems 816
Introduction 817
ORNL case study 1—development of the CBMS 817
Statement of the situation 817
Issues 818
Solution 818
Evaluation of effectiveness 819
ORNL case study 2—development of the Common Radar Environment Simulator 820
Statement of the situation 820
Issues 821
Solution 823
Evaluation of effectiveness 823
Case study 3: design of a parallel computer-based, streaming digital video instrument 825
Case study 4: troubleshooting a boiler points out the need for good, comprehensive design and development 828
Case study 5: debugging of electromagnetic compatibility issues 830
References 838
Appendix A: Dependability Calculations 840
Brief overview 840
Observed failure rates 841
First approximation: simplified failure rates 841
Reliability with multiple components: simplex system 843
Reliability with multiple components: identical parallel units in the system 844
Maintainability 845
Availability 845
Defining reliability: mechanical wear out 845
Experimental analysis 846
Recommended Reading 846
References 847
Index 848
Author’s Biographies
Chapter Authors
Allison Fritz is an Organization Development and Facilitation professional with over 20 years’ experience in a variety of industries. Presently working as a Sr. Organization Development and Training Consultant with the Johns Hopkins Health System, she has also worked within higher education, the petroleum industry, and independent consulting, serving both Fortune 100 and small business, designing and facilitating processes. Allison’s expertise is in team development, change management, leader development, strategic visioning, and coaching. With 14 years in management roles, she applies her experience to her work. Allison has a doctoral degree in Organization and Staff Development from the University of Maryland College Park, a Master’s degree in Counseling and Student Personnel, and a Bachelor’s degree in Communications and Psychology from the University of Delaware; as well as holds several certifications including, Emotional Intelligence (EQ2.0, 360), Crucial Conversations, Strong Interest Inventory, and MBTI. Allison focuses her work on encouraging leaders, teams and organizations to realize positive change.
Michael F. (Mike) Gard, received his BSEE from Kansas State University, MSEE (Interdepartmental Program in Biomedical Engineering) from Washington University in St. Louis, and PhDEE (Geophysics minor) from Southern Methodist University. He has over 40 years of industrial experience in aircraft, medical equipment, clinical engineering, petroleum, and construction industries. He is presently Sr. Product Design Engineer at The Charles Machine Works, Perry, OK. An adjunct professor, he occasionally teaches at Oklahoma State University. He is a registered professional engineer, patent agent, inventor (34 US patents), author, member of the IEEE Instrumentation and Measurement Society’s Administrative Committee, and editor-in-chief of IEEE Instrumentation and Measurement Magazine. His technical interests include real-time data acquisition and precision analog and analog/digital systems for low power and hostile environments.
Robert Oshana has 30 years of experience in the software industry, primarily focused on embedded and real-time systems for the defense and semiconductor industries. He has BSEE, MSEE, MSCS, and MBA degrees and is a senior member of IEEE. He is a member of several Advisory Boards including the Embedded Systems group, where he is also an international speaker. He has over 200 presentations and publications in various technology fields and has written several books on Embedded software technology including “Software Engineering for Embedded Systems.” He is an adjunct professor at Southern Methodist University where he teaches graduate software engineering courses. He is a distinguished member of Technical Staff and Director of Global Software R&D for Digital Networking at Freescale Semiconductor.
Geoff Patch has over 30 years experience as a software engineer. He has worked for the Australian government, in academia, and for a number of engineering companies. Since 1987, he has specialized in embedded systems, primarily in the areas of radar target tracking, radar signal processing, and command and control systems. He is also keenly interested in software process improvement, technical team leadership, and technical management. He has developed software for numerous commercially successful radar systems ranging from conventional maritime surveillance, through specialized applications such as submarine periscope detection and up to large air defense systems. He is currently the manager of a team of nearly 30 software engineers involved in the development of new radar systems at CEA Technologies in Canberra, Australia.
Eugene Vasserman received his PhD and master’s degrees in Computer Science in 2010 and 2008, respectively, from the University of Minnesota. His BS, in Biochemistry and Neuroscience with a Computer Science minor, is also from the University of Minnesota (2003). In 2013, he received the NSF CAREER award for work on secure next generation medical systems.
Tim Wescott has 25 years of real-world experience in embedded systems design, with roles ranging from software designer to circuit designer to systems architect. Tim has worked on small, inexpensive hand-held instruments, on large airborne imaging systems, and on nearly everything in between. He has experience in all phases of system life cycles, ranging from designing new systems from a clean sheet of paper to extending the useful lives of systems that are on the verge of obsolescence. Tim is author of “Applied Control Theory for Embedded Systems”, aimed at engineers who slept through control theory class in University, and who now need to design a system that must successfully implement a feedback control loop. Tim is the owner of Wescott Design Services, which provides analysis, design, and troubleshooting of embedded control systems, with a particular emphasis on control of dynamic systems, low-level communications systems, and metrology. Wescott Design Systems has helped customers of all sorts of problems ranging from drives for 1/2-inch diameter brushless motors to implementing communications systems for deep-well drilling platforms.
Steve Zeise is a mechanical engineer and designer with 30 years’ experience in all things mechanical. He received a BS in Mechanical Engineering from Rose-Hulman Institute of Technology and immediately went to work for Westinghouse Defense and Electronics Systems Center designing mechanisms, structures, and cooling systems supporting embedded systems in night vision cameras. With positions at Northrop-Grumman and Lockheed Martin, he gained experience in structural analysis and environmental testing. He is currently with FLIR Systems where he helped to setup a small R&D facility in Orlando, FL and for the past 15 years has worked to help FLIR Systems solve complex vibration problems.
Case Study Authors
David von Oheimb received his PhD in computer science in 2001 from the Munich University of Technology, where he focused on machine-assisted formal modeling and verification of the programming language Java. He joined Siemens Corporate Technology, where he became a senior researcher, developer, and key expert consultant on IT security. His specific areas of expertise are security architecture, formal analysis, and IT security certification according to the Common Criteria. He has been involved as participant and leader of various Siemens-internal and EU-funded R&D projects on security protocol and information flow analysis using model checkers and theorem provers and of various industrial projects dealing for instance with Infineon smart cards, software update mechanisms for Boeing and Continental Automotive, and German and Austrian smart metering systems.
Kenneth W. Tobin is the Director of the Electrical and Electronics Systems Research (EESR) Division at the Oak Ridge National Laboratory (ORNL), Oak Ridge, Tennessee, USA, where he has been working in various R&D and leadership capacities since 1987. The EESR Division is composed of 150 staff who perform R&D in electronics, sensors, communications, and controls for energy efficiency, resiliency, and security. His personal research areas encompass photonics, neutronics, x-ray, SEM, electronic imaging and microscopy coupled with signal processing and machine learning. Science and technology specialty in computational imaging, image metrology, object segmentation, and feature generation from multi-spectral, multi-source imagery for inverse imaging, robust human-level classifiers, image archival and retrieval applications, and image-based informatics. Dr. Tobin was named an ORNL Corporate Research Fellow in 2003 for his contributions to the field of applied computer vision research. He has authored and co-authored over 164 publications and he currently holds fourteen U.S. Patents in areas of computer vision, photonics, radiography, and microscopy. Dr. Tobin is a Fellow of the Institute of Electrical and Electronics Engineers (IEEE) and a Fellow of the International Society for Optics and Photonics (SPIE), where he is currently an Associate Editor for the Journal of Electronic Imaging. Dr. Tobin has a Ph.D. in Nuclear Engineering from the University of Virginia, an M.S. in Nuclear Engineering from Virginia Tech, and a B.S. in Physics also from Virginia Tech.
Dwight A. Clayton is the group leader of the Electronic and Embedded Systems group at the Oak Ridge National Laboratory (ORNL), Oak Ridge, TN. The mission of the Electronic and Embedded Systems (EESG) group is to apply modern electronic methods to provide solutions to challenges that are important to the ORNL, the Department of Energy, other federal agencies, and private industry. He joined ORNL in 1983 as a development staff member in the Instrumentation and Controls Division. In 1994, he was named leader of the Electronic and Embedded Systems Group. Since 2000, the innovative efforts of the Electronic and Embedded Systems group have resulted in the receipt of four R&D 100 awards. He has an MS and BS in electrical engineering from Tennessee Technological University.
Bogdan Vacaliuc is a research and development staff member in the Electronic and Embedded Systems Group of the Oak Ridge National Laboratory’s Measurement Science and Systems Engineering Division....
| Erscheint lt. Verlag | 30.8.2014 |
|---|---|
| Sprache | englisch |
| Themenwelt | Technik ► Elektrotechnik / Energietechnik |
| Wirtschaft ► Betriebswirtschaft / Management ► Unternehmensführung / Management | |
| ISBN-10 | 0-12-405863-9 / 0124058639 |
| ISBN-13 | 978-0-12-405863-7 / 9780124058637 |
| Haben Sie eine Frage zum Produkt? |
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