List of Contributors

Ruzena Bajcsy,     Electrical Engineering and Computer Science, University of California, Berkeley, California, USA

Paolo Barsocchi,     ISTI-CNR, Pisa, Italy

Fernando Benito-Lopez

CIC microGUNE, Arrasate-Mondragón, Spain

INSIGHT: Centre for Data Analytics, National Centre for Sensor Research, Dublin City University, Dublin, Ireland

Mattia Bertschi,     Tampere University of Technology, Tampere, Finland

Laura Caldani,     Smartex s.r.l., Pisa, Italy

Alexander J. Casson,     Imperial College, London, UK

Gert Cauwenberghs,     Department of Bioengineering at University of California, San Diego, La Jolla, CA, USA

Guangwei Chen,     Imperial College, London, UK

Yu M. Chi,     Cognionics, Inc., San Diego, CA, USA

Kyunghee Chung,     Georgia Institute of Technology, School of Materials Science & Engineering, Atlanta, Georgia, USA

Shirley Coyle,     INSIGHT: Centre for Data Analytics, National Centre for Sensor Research, Dublin City University, Dublin, Ireland

Vincenzo F. Curto,     INSIGHT: Centre for Data Analytics, National Centre for Sensor Research, Dublin City University, Dublin, Ireland

Dermot Diamond,     INSIGHT: Centre for Data Analytics, National Centre for Sensor Research, Dublin City University, Dublin, Ireland

Xiaorong Ding,     Department of Electronic Engineering, The Chinese University of Hong Kong, Hong Kong SAR, China

Tobias Dräger,     Fraunhofer Institute for Integrated Circuits IIS, Nuremberg, Germany

Lucy Dunne,     University of Minnesota, Minneapolis, MN, USA

John Dykstra,     MetaLogics Inc., Minneapolis, Minnesota, USA

Larisa Florea,     INSIGHT: Centre for Data Analytics, National Centre for Sensor Research, Dublin City University, Dublin, Ireland

Juan M. Fontana,     The University of Alabama, Tuscaloosa, Alabama, USA

Maysam Ghovanloo,     GT-Bionics Lab, School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia, USA

Sohmyung Ha,     Department of Bioengineering at University of California, San Diego, La Jolla, CA, USA

Xueliang Huo,     Interactive Entertainment Business, Microsoft, Redmond, Washington, USA

Jung-Hwan Hwang,     Electronics and Telecommunications Research, Daejeon, Korea

Chang-Hee Hyoung,     Electronics and Telecommunications Research, Daejeon, Korea

Roozbeh Jafari,     University of Texas at Dallas, Richardson, Texas, USA

Sundaresan Jayaraman,     Georgia Institute of Technology, School of Materials Science & Engineering, Atlanta, Georgia, USA

Chul Kim,     Department of Bioengineering at University of California, San Diego, La Jolla, CA, USA

Ilkka Korhonen,     Tampere University of Technology, Tampere, Finland

Yuichi Kurita,     Institute of Engineering, Hiroshima University, Hiroshima, Japan

Tomohiro Kuroda,     Kyoto University Hospital, Kyoto, Japan

Mathieu Lemay,     Tampere University of Technology, Tampere, Finland

Ming Li,     Utah State University, Logan, Utah, USA

Vitali Loseu,     MPI Lab, Samsung Research America

Ningqi Luo,     Department of Electronic Engineering, The Chinese University of Hong Kong, Hong Kong SAR, China

I. Maglogiannis,     Department of Digital Systems, University of Piraeus, Piraeus, Greece

Masaaki Makikawa,     Ritsumeikan University, Kyoto, Japan

A.L.R. Mansano,     Delft University of Technology, Delft, The Netherlands

Atsuji Masuda,     Industrial Technology Center of Fukui Prefecture, Fukui, Japan

Loreto Mateu,     Fraunhofer Institute for Integrated Circuits IIS, Nuremberg, Germany

Iker Mayordomo,     Fraunhofer Institute for Integrated Circuits IIS, Nuremberg, Germany

Ed Melanson,     University of Colorado Anschutz Medical Campus, Denver, Colorado, USA

Shima Okada,     Kinki University, Osaka, Japan

Maria Pacelli,     Smartex s.r.l., Pisa, Italy

Rita Paradiso,     Smartex s.r.l., Pisa, Italy

Jakub Parak,     Tampere University of Technology, Tampere, Finland

Sungmee Park,     Georgia Institute of Technology, School of Materials Science & Engineering, Atlanta, Georgia, USA

Markus Pollak,     Fraunhofer Institute for Integrated Circuits IIS, Nuremberg, Germany

Carmen C.Y. Poon,     Department of Electronic Engineering and Department of Surgery, The Chinese University of Hong Kong, Hong Kong SAR, China

Francesco Potortì,     ISTI-CNR, Pisa, Italy

Halley Profita,     University of Minnesota, Minneapolis, MN, USA

Philippe Renevey,     Tampere University of Technology, Tampere, Finland

Esther Rodriguez-Villegas,     Imperial College, London, UK

Giovanni Salvatore,     ETH Zürich, Zürich, Switzerland

H.G. Sandalidis,     Department of Computer Science and Biomedical Informatics, University of Thessaly, Lamia, Greece

Edward Sazonov,     The University of Alabama, Tuscaloosa, Alabama, USA

W.A. Serdijn,     Delft University of Technology, Delft, The Netherlands

Edmund Seto,     School of Public Health, University of Washington, Seattle, Washington, USA

Lu Shi,     University of Arkansas at Little Rock, Little Rock, Arkansas, USA

Naruhiro Shiozawa,     Ritsumeikan University, Kyoto, Japan

Josep Sola,     Tampere University of Technology, Tampere, Finland

M. Stoopman,     Delft University of Technology, Delft, The Netherlands

Neil Szuminsky,     MetaLogics Inc., Minneapolis, Minnesota, USA

Hideya Takahashi,     Osaka City University, Osaka, Japan

Toshiyo Tamura,     Osaka Electro-Communication University, Neyagawa, Japan

Gerhard Tröster,     ETH Zürich, Zürich, Switzerland

Jian Wu,     University of Texas at Dallas, Richardson, Texas, USA

Shucheng Yu,     University of Arkansas at Little Rock, Little Rock, Arkansas, USA

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